Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    0050395288

    0050395288

    CONN IC DIP SOCKET 28POS TINLEAD

    Molex

    3,797
    RFQ
    0050395288

    Tabla de datos

    - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - - Through Hole Closed Frame - - - - - - -
    940-99-032-24-000000

    940-99-032-24-000000

    CONN SOCKET PLCC 32POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,766
    RFQ
    940-99-032-24-000000

    Tabla de datos

    940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    SIP1X11-011B

    SIP1X11-011B

    SIP1X11-011B-SIP SOCKET 11 CTS

    Amphenol ICC (FCI)

    3,443
    RFQ
    SIP1X11-011B

    Tabla de datos

    SIP1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    AR 22-HGL-TT

    AR 22-HGL-TT

    SOCKET

    Assmann WSW Components

    3,914
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR22-HZL-TT

    AR22-HZL-TT

    CONN IC DIP SOCKET 22POS TIN

    Assmann WSW Components

    4,242
    RFQ
    AR22-HZL-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    115-83-306-41-003101

    115-83-306-41-003101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,467
    RFQ
    115-83-306-41-003101

    Tabla de datos

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-304-41-001101

    116-87-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,608
    RFQ
    116-87-304-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS44-Z-SM

    A-CCS44-Z-SM

    CONN SOCKET PLCC 44POS TIN

    Assmann WSW Components

    4,638
    RFQ
    A-CCS44-Z-SM

    Tabla de datos

    - Bag Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    HLS-0201-T-2

    HLS-0201-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,365
    RFQ
    HLS-0201-T-2

    Tabla de datos

    HLS Tube Active SIP 2 (2 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    940-99-044-24-000000

    940-99-044-24-000000

    CONN SOCKET PLCC 44POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,912
    RFQ
    940-99-044-24-000000

    Tabla de datos

    940 Tube Obsolete PLCC 44 (4 x 11) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    940-99-020-17-400000

    940-99-020-17-400000

    CONN SOCKET PLCC 20POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,467
    RFQ
    940-99-020-17-400000

    Tabla de datos

    940 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AJ 24-LC

    AJ 24-LC

    SOCKET

    Assmann WSW Components

    4,601
    RFQ

    -

    - Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    123-83-304-41-001101

    123-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,601
    RFQ
    123-83-304-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP318-011B

    DIP318-011B

    DIP318-011B-DIP SOCKET 18 CTS

    Amphenol ICC (FCI)

    4,201
    RFQ
    DIP318-011B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    04-1518-10T

    04-1518-10T

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    2,202
    RFQ
    04-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP1X09-001B

    SIP1X09-001B

    SIP1X09-001B-SIP SOCKET 9 CTS

    Amphenol ICC (FCI)

    2,408
    RFQ
    SIP1X09-001B

    Tabla de datos

    SIP1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP050-1X07-157B

    SIP050-1X07-157B

    1X07-157B-SIP SOCKET 7 CTS

    Amphenol ICC (FCI)

    3,437
    RFQ
    SIP050-1X07-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X13-011B

    SIP1X13-011B

    SIP1X13-011B-SIP SOCKET 13 CTS

    Amphenol ICC (FCI)

    4,959
    RFQ
    SIP1X13-011B

    Tabla de datos

    SIP1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP050-1X06-160B

    SIP050-1X06-160B

    1X06-160B-SIP SOCKET 6 CTS

    Amphenol ICC (FCI)

    3,482
    RFQ
    SIP050-1X06-160B

    Tabla de datos

    SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR20-HZL-TT

    AR20-HZL-TT

    CONN IC DIP SOCKET 20POS TIN

    Assmann WSW Components

    3,533
    RFQ
    AR20-HZL-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    Total 19086 Record«Prev1... 9091929394959697...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios