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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-87-306-41-018101

    116-87-306-41-018101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,543
    RFQ
    116-87-306-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-306-41-005101

    110-83-306-41-005101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,885
    RFQ
    110-83-306-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-0513-10H

    02-0513-10H

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,795
    RFQ
    02-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0518-10

    04-0518-10

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,322
    RFQ
    04-0518-10

    Tabla de datos

    518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-1518-10

    04-1518-10

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    3,223
    RFQ
    04-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-304-41-018101

    116-83-304-41-018101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,151
    RFQ
    116-83-304-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-304-41-009101

    116-87-304-41-009101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,083
    RFQ
    116-87-304-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-610-41-005101

    110-87-610-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,966
    RFQ
    110-87-610-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 28-HZL/7-TT

    AR 28-HZL/7-TT

    CONN IC DIP SOCKET 28POS TIN

    Assmann WSW Components

    2,579
    RFQ
    AR 28-HZL/7-TT

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR18-HZL-TT

    AR18-HZL-TT

    CONN IC DIP SOCKET 18POS TIN

    Assmann WSW Components

    4,997
    RFQ
    AR18-HZL-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    115-83-306-41-001101

    115-83-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,246
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A24-LCG

    A24-LCG

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    2,243
    RFQ

    -

    - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    DIP314-001B

    DIP314-001B

    DIP SOCKET 14 CTS

    Amphenol ICC (FCI)

    2,475
    RFQ
    DIP314-001B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AW 127-23/Z-T

    AW 127-23/Z-T

    SOCKET 23 CONTACTS SINGLE ROW

    Assmann WSW Components

    3,647
    RFQ
    AW 127-23/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    03-0518-11

    03-0518-11

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,810
    RFQ
    03-0518-11

    Tabla de datos

    518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-306-31-012101

    614-87-306-31-012101

    CONN IC DIP SOCKET 325POS GOLD

    Preci-Dip

    4,111
    RFQ
    614-87-306-31-012101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 325 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-304-41-003101

    116-83-304-41-003101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,123
    RFQ
    116-83-304-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    WMS-180Z

    WMS-180Z

    CONN IC DIP SOCKET 18POS GOLD

    On Shore Technology Inc.

    3,283
    RFQ
    WMS-180Z

    Tabla de datos

    WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
    A18-LCG-T-R

    A18-LCG-T-R

    CONN IC DIP SOCKET 18POS GOLD

    Assmann WSW Components

    2,044
    RFQ
    A18-LCG-T-R

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    241-14-1-03

    241-14-1-03

    CONN IC DIP SOCKET 14POS TIN

    CNC Tech

    4,372
    RFQ
    241-14-1-03

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    Total 19086 Record«Prev1... 8889909192939495...955Next»
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