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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR 06-HZW/TN

    AR 06-HZW/TN

    SOCKET

    Assmann WSW Components

    2,221
    RFQ
    AR 06-HZW/TN

    Tabla de datos

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Phosphor Bronze Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    03-0513-10

    03-0513-10

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    4,506
    RFQ
    03-0513-10

    Tabla de datos

    0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    121-83-304-41-001101

    121-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,864
    RFQ
    121-83-304-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS028-Z-SM/P

    A-CCS028-Z-SM/P

    SOCKET

    Assmann WSW Components

    2,802
    RFQ

    -

    - Bulk Active PLCC 28 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    AR08-HZW/T

    AR08-HZW/T

    CONN IC DIP SOCKET 8POS GOLD

    Assmann WSW Components

    3,419
    RFQ
    AR08-HZW/T

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-CCS20-Z-SM-R

    A-CCS20-Z-SM-R

    CONN SOCKET PLCC 20POS TIN

    Assmann WSW Components

    3,688
    RFQ
    A-CCS20-Z-SM-R

    Tabla de datos

    - Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    SU1210000000G

    SU1210000000G

    SU-2*6P BLACK ; 10.0MM CLIP PLA

    Amphenol Anytek

    3,182
    RFQ

    -

    SU Bulk Active DIP, 0.1" (2.54mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    2-641264-1

    2-641264-1

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    2,849
    RFQ
    2-641264-1

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    110-87-610-41-001101

    110-87-610-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,697
    RFQ
    110-87-610-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-304-41-012101

    116-83-304-41-012101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,938
    RFQ
    116-83-304-41-012101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AW 127-26/Z-T

    AW 127-26/Z-T

    SOCKET 26 CONTACTS SINGLE ROW

    Assmann WSW Components

    4,599
    RFQ
    AW 127-26/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    SIP1X14-011B

    SIP1X14-011B

    SIP1X14-011B-SIP SOCKET 14 CTS

    Amphenol ICC (FCI)

    3,178
    RFQ
    SIP1X14-011B

    Tabla de datos

    SIP1x Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    110-87-312-41-005101

    110-87-312-41-005101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,095
    RFQ
    110-87-312-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-610-41-001101

    115-87-610-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,943
    RFQ

    -

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    BU080Z

    BU080Z

    CONN IC DIP SOCKET 8POS

    On Shore Technology Inc.

    43
    RFQ

    -

    BU Tube Active - 8 (2 x 4) - - - - - - - - - - - - -
    AR16-HZL/01-TT

    AR16-HZL/01-TT

    CONN IC DIP SOCKET 16POS GOLD

    Assmann WSW Components

    2,427
    RFQ
    AR16-HZL/01-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-CCS52-Z

    A-CCS52-Z

    CONN SOCKET PLCC 52POS TIN

    Assmann WSW Components

    4,308
    RFQ
    A-CCS52-Z

    Tabla de datos

    - Bag Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    04-0518-10H

    04-0518-10H

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,257
    RFQ
    04-0518-10H

    Tabla de datos

    518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-1518-10H

    04-1518-10H

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    4,361
    RFQ
    04-1518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    05-0518-10

    05-0518-10

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    4,032
    RFQ
    05-0518-10

    Tabla de datos

    518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 9192939495969798...955Next»
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