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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    114-83-306-41-117101

    114-83-306-41-117101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,729
    RFQ
    114-83-306-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-306-41-134161

    114-83-306-41-134161

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,527
    RFQ
    114-83-306-41-134161

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X12-014B

    SIP1X12-014B

    SIP1X12-014B-SIP SOCKET 12 CTS

    Amphenol ICC (FCI)

    2,451
    RFQ
    SIP1X12-014B

    Tabla de datos

    SIP1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X10-001B

    SIP1X10-001B

    SIP1X10-001B-SIP SOCKET 10 CTS

    Amphenol ICC (FCI)

    2,672
    RFQ
    SIP1X10-001B

    Tabla de datos

    SIP1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    HLS-0101-G-10

    HLS-0101-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,010
    RFQ
    HLS-0101-G-10

    Tabla de datos

    HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-87-306-41-003101

    116-87-306-41-003101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,032
    RFQ
    116-87-306-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    940-99-028-24-000000

    940-99-028-24-000000

    CONN SOCKET PLCC 28POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    3,131
    RFQ
    940-99-028-24-000000

    Tabla de datos

    940 Tube Obsolete PLCC 28 (4 x 7) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AR 14 HGL-TT

    AR 14 HGL-TT

    SOCKET

    Assmann WSW Components

    4,559
    RFQ
    AR 14 HGL-TT

    Tabla de datos

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR20-HZL/01-TT

    AR20-HZL/01-TT

    CONN IC DIP SOCKET 20POS GOLD

    Assmann WSW Components

    2,401
    RFQ
    AR20-HZL/01-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    241-16-1-03

    241-16-1-03

    CONN IC DIP SOCKET 16POS TIN

    CNC Tech

    2,332
    RFQ
    241-16-1-03

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A06-LCG-T-R

    A06-LCG-T-R

    CONN IC DIP SOCKET 6POS GOLD

    Assmann WSW Components

    2,454
    RFQ
    A06-LCG-T-R

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold - - Through Hole - Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A-CCS68-Z

    A-CCS68-Z

    CONN SOCKET PLCC 68POS TIN

    Assmann WSW Components

    3,276
    RFQ
    A-CCS68-Z

    Tabla de datos

    - Bag Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    HLS-0101-T-12

    HLS-0101-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,015
    RFQ
    HLS-0101-T-12

    Tabla de datos

    HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    AW 127-24/Z-T

    AW 127-24/Z-T

    SOCKET 24 CONTACTS SINGLE ROW

    Assmann WSW Components

    2,248
    RFQ
    AW 127-24/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    110-83-306-41-605101

    110-83-306-41-605101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,197
    RFQ
    110-83-306-41-605101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    03-0513-10T

    03-0513-10T

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    4,242
    RFQ
    03-0513-10T

    Tabla de datos

    0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0102-S-2

    HLS-0102-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,618
    RFQ
    HLS-0102-S-2

    Tabla de datos

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    AR 24-HZL/7-TT

    AR 24-HZL/7-TT

    CONN IC DIP SOCKET 24POS TIN

    Assmann WSW Components

    3,364
    RFQ
    AR 24-HZL/7-TT

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    SIP1X12-011B

    SIP1X12-011B

    SIP1X12-011B-SIP SOCKET 12 CTS

    Amphenol ICC (FCI)

    3,966
    RFQ
    SIP1X12-011B

    Tabla de datos

    SIP1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    2-382189-1

    2-382189-1

    CONN IC DIP SOCKET 32POS TIN

    TE Connectivity AMP Connectors

    4,740
    RFQ
    2-382189-1

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic -
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