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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR18-HZL/07-TT

    AR18-HZL/07-TT

    CONN IC DIP SOCKET 18POS GOLD

    Assmann WSW Components

    0
    RFQ
    AR18-HZL/07-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR14-HZL/01-TT

    AR14-HZL/01-TT

    CONN IC DIP SOCKET 14POS GOLD

    Assmann WSW Components

    0
    RFQ
    AR14-HZL/01-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AW 127-10/Z-T

    AW 127-10/Z-T

    SOCKET 10 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-10/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    122-87-304-41-001101

    122-87-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    122-87-304-41-001101

    Tabla de datos

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-304-41-001101

    123-87-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    123-87-304-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-306-41-105161

    110-87-306-41-105161

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-306-41-105161

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    243-48-1-06

    243-48-1-06

    CONN IC DIP SOCKET 48POS TIN

    CNC Tech

    0
    RFQ
    243-48-1-06

    Tabla de datos

    - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    WMS-160Z

    WMS-160Z

    CONN IC DIP SOCKET 16POS GOLD

    On Shore Technology Inc.

    0
    RFQ
    WMS-160Z

    Tabla de datos

    WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
    116-87-306-41-006101

    116-87-306-41-006101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-306-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-2513-10

    02-2513-10

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-2513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-3513-10

    02-3513-10

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-3513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-4513-10

    02-4513-10

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-4513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    01-0518-11H

    01-0518-11H

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    0
    RFQ
    01-0518-11H

    Tabla de datos

    518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    A22-LCG

    A22-LCG

    CONN IC DIP SOCKET 22POS GOLD

    Assmann WSW Components

    0
    RFQ
    A22-LCG

    Tabla de datos

    - - Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    2-382515-3

    2-382515-3

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ
    2-382515-3

    Tabla de datos

    Diplomate DL Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    AW 127-21/Z-T

    AW 127-21/Z-T

    SOCKET 21 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-21/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    116-87-304-41-008101

    116-87-304-41-008101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-304-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-210-41-005101

    110-87-210-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-210-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-304-41-036101

    146-87-304-41-036101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    146-87-304-41-036101

    Tabla de datos

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-304-41-006101

    116-83-304-41-006101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-304-41-006101

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 8687888990919293...955Next»
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