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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR 16 HGL-TT

    AR 16 HGL-TT

    SOCKET

    Assmann WSW Components

    4,815
    RFQ
    AR 16 HGL-TT

    Tabla de datos

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    940-99-068-24-000000

    940-99-068-24-000000

    CONN SOCKET PLCC 68POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,000
    RFQ
    940-99-068-24-000000

    Tabla de datos

    940 Tube Obsolete PLCC 68 (4 x 17) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-87-308-41-001101

    612-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,562
    RFQ
    612-87-308-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP316-014B

    DIP316-014B

    DIP SOCKET 16 CTS

    Amphenol ICC (FCI)

    4,807
    RFQ
    DIP316-014B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    115-87-310-41-001101

    115-87-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,348
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 36-HZL-TT

    AR 36-HZL-TT

    SOCKET

    Assmann WSW Components

    4,320
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A-CCS52-Z-SM

    A-CCS52-Z-SM

    CONN SOCKET PLCC 52POS TIN

    Assmann WSW Components

    3,555
    RFQ
    A-CCS52-Z-SM

    Tabla de datos

    - Bag Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    940-99-028-17-400000

    940-99-028-17-400000

    CONN SOCKET PLCC 28POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,817
    RFQ
    940-99-028-17-400000

    Tabla de datos

    940 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    A14-LCG-T-R

    A14-LCG-T-R

    CONN IC DIP SOCKET 14POS GOLD

    Assmann WSW Components

    4,421
    RFQ
    A14-LCG-T-R

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    DIP320-011B

    DIP320-011B

    DIP320-011B-DIP SOCKET 20 CTS

    Amphenol ICC (FCI)

    2,653
    RFQ
    DIP320-011B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    540-88-032-17-400-2

    540-88-032-17-400-2

    CONN SOCKET PLCC 32POS TIN

    Preci-Dip

    4,004
    RFQ
    540-88-032-17-400-2

    Tabla de datos

    540 Bulk Obsolete PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    AW 127-25/Z-T

    AW 127-25/Z-T

    SOCKET 25 CONTACTS SINGLE ROW

    Assmann WSW Components

    4,057
    RFQ
    AW 127-25/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    822475-2

    822475-2

    CONN SOCKET PLCC 32POS TIN

    TE Connectivity AMP Connectors

    3,274
    RFQ
    822475-2

    Tabla de datos

    - Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -
    4842-6004-CP

    4842-6004-CP

    CONN IC DIP SOCKET 42POS TIN

    3M

    2,198
    RFQ

    -

    4800 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    AR24-HZL-TT

    AR24-HZL-TT

    CONN IC DIP SOCKET 24POS TIN

    Assmann WSW Components

    2,170
    RFQ
    AR24-HZL-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    04-1518-00

    04-1518-00

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    2,258
    RFQ
    04-1518-00

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0518-11H

    02-0518-11H

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,782
    RFQ
    02-0518-11H

    Tabla de datos

    518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-1518-11H

    02-1518-11H

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    2,133
    RFQ
    02-1518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    146-83-304-41-035101

    146-83-304-41-035101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,321
    RFQ
    146-83-304-41-035101

    Tabla de datos

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-304-41-036101

    146-83-304-41-036101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,204
    RFQ
    146-83-304-41-036101

    Tabla de datos

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 93949596979899100...955Next»
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