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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    1571994-2

    1571994-2

    CONN SOCKET SIP 2POS GOLD

    TE Connectivity AMP Connectors

    4,289
    RFQ
    1571994-2

    Tabla de datos

    510 Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    612-83-304-41-001101

    612-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,576
    RFQ
    612-83-304-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X05-041B

    SIP1X05-041B

    SIP1X05-041B-SIP SOCKET 5 CTS

    Amphenol ICC (FCI)

    2,012
    RFQ
    SIP1X05-041B

    Tabla de datos

    SIP1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    1-390263-5

    1-390263-5

    CONN IC DIP SOCKET 42POS TIN

    TE Connectivity AMP Connectors

    3,334
    RFQ
    1-390263-5

    Tabla de datos

    - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390262-6

    1-390262-6

    CONN IC DIP SOCKET 42POS TIN

    TE Connectivity AMP Connectors

    2,635
    RFQ
    1-390262-6

    Tabla de datos

    - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    614-87-306-41-001101

    614-87-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,172
    RFQ
    614-87-306-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL/7-TT

    AR 22-HZL/7-TT

    SOCKET

    Assmann WSW Components

    4,954
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Brass Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-87-306-41-105101

    110-87-306-41-105101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,252
    RFQ
    110-87-306-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS28-Z-SM

    A-CCS28-Z-SM

    CONN SOCKET PLCC 28POS TIN

    Assmann WSW Components

    4,398
    RFQ
    A-CCS28-Z-SM

    Tabla de datos

    - Bag Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A18-LCG

    A18-LCG

    CONN IC DIP SOCKET 18POS GOLD

    Assmann WSW Components

    4,233
    RFQ

    -

    - - Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    AW 127-20/Z-T

    AW 127-20/Z-T

    SOCKET 20 CONTACTS SINGLE ROW

    Assmann WSW Components

    2,970
    RFQ
    AW 127-20/Z-T

    Tabla de datos

    - Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    612-87-306-41-001101

    612-87-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,152
    RFQ
    612-87-306-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS32-Z-SM

    A-CCS32-Z-SM

    CONN SOCKET PLCC 32POS TIN

    Assmann WSW Components

    4,851
    RFQ
    A-CCS32-Z-SM

    Tabla de datos

    - Bag Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    03-0518-10T

    03-0518-10T

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    3,797
    RFQ
    03-0518-10T

    Tabla de datos

    518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    01-0517-90C

    01-0517-90C

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    2,431
    RFQ
    01-0517-90C

    Tabla de datos

    0517 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AR16-HZL/07-TT

    AR16-HZL/07-TT

    CONN IC DIP SOCKET 16POS GOLD

    Assmann WSW Components

    4,769
    RFQ
    AR16-HZL/07-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    116-87-304-41-002101

    116-87-304-41-002101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,549
    RFQ
    116-87-304-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    241-06-1-03

    241-06-1-03

    CONN IC DIP SOCKET 6POS TIN

    CNC Tech

    2,440
    RFQ
    241-06-1-03

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 10-HZL/01-TT

    AR 10-HZL/01-TT

    CONN IC DIP SOCKET 10POS TIN

    Assmann WSW Components

    2,554
    RFQ
    AR 10-HZL/01-TT

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A-CCS20-Z

    A-CCS20-Z

    CONN SOCKET PLCC 20POS TIN

    Assmann WSW Components

    3,449
    RFQ
    A-CCS20-Z

    Tabla de datos

    - Bag Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 8586878889909192...955Next»
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