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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    01-0508-20

    01-0508-20

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    4,184
    RFQ
    01-0508-20

    Tabla de datos

    508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    01-0508-30

    01-0508-30

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    3,043
    RFQ
    01-0508-30

    Tabla de datos

    508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    AW 127-30/Z-T

    AW 127-30/Z-T

    SOCKET 30 CONTACTS SINGLE ROW

    Assmann WSW Components

    3,663
    RFQ
    AW 127-30/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    AJ 28-LC

    AJ 28-LC

    SOCKET

    Assmann WSW Components

    4,186
    RFQ

    -

    - Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    116-87-304-41-011101

    116-87-304-41-011101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,940
    RFQ
    116-87-304-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PRT-07939

    PRT-07939

    DIP SOCKETS SOLDER TAIL - 14-PIN

    SparkFun Electronics

    4,141
    RFQ

    -

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) - - - - Through Hole Open Frame Solder - - - - - -
    PRT-07938

    PRT-07938

    DIP SOCKETS SOLDER TAIL - 16-PIN

    SparkFun Electronics

    3,884
    RFQ

    -

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - - - Through Hole Open Frame Solder - - - - - -
    HLS-0103-TT-10

    HLS-0103-TT-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,998
    RFQ
    HLS-0103-TT-10

    Tabla de datos

    HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    110-87-314-41-605101

    110-87-314-41-605101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,334
    RFQ
    110-87-314-41-605101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR28-HZL-TT

    AR28-HZL-TT

    CONN IC DIP SOCKET 28POS TIN

    Assmann WSW Components

    3,683
    RFQ
    AR28-HZL-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-CCS20-Z-R

    A-CCS20-Z-R

    CONN SOCKET PLCC 20POS TIN

    Assmann WSW Components

    3,408
    RFQ
    A-CCS20-Z-R

    Tabla de datos

    - Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    115-83-308-41-001101

    115-83-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,992
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-304-41-008101

    116-83-304-41-008101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,737
    RFQ
    116-83-304-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0518-10H

    05-0518-10H

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,709
    RFQ
    05-0518-10H

    Tabla de datos

    518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-1518-10

    06-1518-10

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,333
    RFQ
    06-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0513-10T

    04-0513-10T

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    4,539
    RFQ
    04-0513-10T

    Tabla de datos

    0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    808-AG11D-ES

    808-AG11D-ES

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,694
    RFQ
    808-AG11D-ES

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    SBU130Z

    SBU130Z

    CONN SOCKET SIP 13POS GOLD

    On Shore Technology Inc.

    4,854
    RFQ
    SBU130Z

    Tabla de datos

    SBU Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    02-0513-11

    02-0513-11

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,186
    RFQ
    02-0513-11

    Tabla de datos

    0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-306-41-105101

    110-83-306-41-105101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,372
    RFQ
    110-83-306-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 96979899100101102103...955Next»
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