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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    7100286975

    7100286975

    TEXTOOLBURN-IN GRID ZIP SOCKETS

    3M

    0
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    162-PLS20020-12

    162-PLS20020-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    162-PLS20020-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    162-PRS20020-12

    162-PRS20020-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    162-PRS20020-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    558-10-652M35-001104

    558-10-652M35-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    0
    RFQ
    558-10-652M35-001104

    Tabla de datos

    558 Bulk Active BGA 652 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    164-PRS21013-12

    164-PRS21013-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    164-PRS21013-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    518-77-652M35-001105

    518-77-652M35-001105

    CONN SOCKET PGA 652POS GOLD

    Preci-Dip

    0
    RFQ
    518-77-652M35-001105

    Tabla de datos

    518 Bulk Active PGA 652 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    1019-2-0324-0B-01

    1019-2-0324-0B-01

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    0
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    168-PRS17011-12

    168-PRS17011-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    168-PRS17011-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    172-PRS16002-12

    172-PRS16002-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    172-PRS16002-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    225-PLS18003-12

    225-PLS18003-12

    ZIF PGA SOCKET 225 PIN 18 X 18

    Aries Electronics

    0
    RFQ

    -

    PLS - Active PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
    518-77-652M35-001106

    518-77-652M35-001106

    CONN SOCKET PGA 652POS GOLD

    Preci-Dip

    0
    RFQ
    518-77-652M35-001106

    Tabla de datos

    518 Bulk Active PGA 652 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    289-PLS17001-12

    289-PLS17001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    289-PLS17001-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    260-5204-01

    260-5204-01

    CONN SOCKET QFN 60POS GOLD

    3M

    0
    RFQ
    260-5204-01

    Tabla de datos

    Textool™ Bulk Active QFN 60 (4 x 15) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020" (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES) -
    175-PRS16005-12

    175-PRS16005-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    175-PRS16005-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    28-3552-18

    28-3552-18

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    0
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    28-3553-18

    28-3553-18

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    0
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    28-6551-18

    28-6551-18

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    0
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    28-6552-18

    28-6552-18

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    0
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    28-6553-18

    28-6553-18

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    0
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3554-18

    28-3554-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    0
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    Total 19086 Record«Prev1... 906907908909910911912913...955Next»
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