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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    181-PLS18041-12

    181-PLS18041-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    181-PLS18041-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    181-PRS18040-12

    181-PRS18040-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    181-PRS18040-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    181-PRS18041-12

    181-PRS18041-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    181-PRS18041-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    40-6554-18

    40-6554-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    0
    RFQ
    40-6554-18

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    40-3554-18

    40-3554-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    0
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    196-PRS14001-16

    196-PRS14001-16

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    196-PRS14001-16

    Tabla de datos

    PRS Bulk Obsolete PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 200°C
    281-PRS19010-12

    281-PRS19010-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    281-PRS19010-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PLS19029-12

    281-PLS19029-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    281-PLS19029-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PRS19029-12

    281-PRS19029-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    281-PRS19029-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    229-PLS16014-12

    229-PLS16014-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    229-PLS16014-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    229-PRS16014-12

    229-PRS16014-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    229-PRS16014-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    264-4205-00

    264-4205-00

    3M TEXTOOL OPEN-TOP SOCKETS FOR

    3M

    0
    RFQ

    -

    Textool™ Box Active - - - - - - - - - - - - - - -
    208-PRS17017-12

    208-PRS17017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    208-PRS17017-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    28-6554-18

    28-6554-18

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    0
    RFQ
    28-6554-18

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    256-PRS16001-12

    256-PRS16001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    256-PRS16001-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS21011-12

    257-PRS21011-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    257-PRS21011-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS21015-12

    257-PRS21015-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    257-PRS21015-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS20018-12

    257-PRS20018-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    257-PRS20018-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    262-PLS20003-12

    262-PLS20003-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    262-PLS20003-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    262-PRS20003-12

    262-PRS20003-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    262-PRS20003-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    Total 19086 Record«Prev1... 908909910911912913914915...955Next»
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