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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    121-PLS13121-12

    121-PLS13121-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,431
    RFQ
    121-PLS13121-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    121-PRS13121-12

    121-PRS13121-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,575
    RFQ
    121-PRS13121-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    80-PRS21027-12

    80-PRS21027-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,579
    RFQ
    80-PRS21027-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    558-10-576M30-001104

    558-10-576M30-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    3,171
    RFQ
    558-10-576M30-001104

    Tabla de datos

    558 Bulk Active BGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    132-PLS14016-12

    132-PLS14016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,118
    RFQ
    132-PLS14016-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    518-77-576M30-001105

    518-77-576M30-001105

    CONN SOCKET PGA 576POS GOLD

    Preci-Dip

    4,078
    RFQ
    518-77-576M30-001105

    Tabla de datos

    518 Bulk Active PGA 576 (30 x 30) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    1017-2-0256-0B-01

    1017-2-0256-0B-01

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    3,035
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    550-10-652M35-001152

    550-10-652M35-001152

    BGA SOLDER TAIL

    Preci-Dip

    3,943
    RFQ
    550-10-652M35-001152

    Tabla de datos

    550 Bulk Active BGA 652 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    200-6321-9UN-1900

    200-6321-9UN-1900

    CONN SOCKET PGA ZIF 441POS GOLD

    3M

    1
    RFQ
    200-6321-9UN-1900

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 441 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    100-PLS17048-12

    100-PLS17048-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,606
    RFQ
    100-PLS17048-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    100-PLS17049-12

    100-PLS17049-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,204
    RFQ
    100-PLS17049-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    100-PRS17048-12

    100-PRS17048-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,202
    RFQ
    100-PRS17048-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    100-PRS17049-12

    100-PRS17049-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,395
    RFQ
    100-PRS17049-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    235-3019-02-0602

    235-3019-02-0602

    CONN ZIG-ZAG ZIF 35POS GOLD

    3M

    2,370
    RFQ
    235-3019-02-0602

    Tabla de datos

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    24-3575-18

    24-3575-18

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    2,667
    RFQ
    24-3575-18

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6575-18

    24-6575-18

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,224
    RFQ
    24-6575-18

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    518-77-576M30-001106

    518-77-576M30-001106

    CONN SOCKET PGA 576POS GOLD

    Preci-Dip

    2,119
    RFQ
    518-77-576M30-001106

    Tabla de datos

    518 Bulk Active PGA 576 (30 x 30) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    144-PLS15026-12

    144-PLS15026-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,924
    RFQ
    144-PLS15026-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    144-PRS15026-12

    144-PRS15026-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,261
    RFQ
    144-PRS15026-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    145-PRS15058-12

    145-PRS15058-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,535
    RFQ
    145-PRS15058-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    Total 19086 Record«Prev1... 903904905906907908909910...955Next»
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