Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    518-77-520M31-001106

    518-77-520M31-001106

    CONN SOCKET PGA 520POS GOLD

    Preci-Dip

    2,179
    RFQ
    518-77-520M31-001106

    Tabla de datos

    518 Bulk Active PGA 520 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    105-PLS17055-12

    105-PLS17055-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,342
    RFQ
    105-PLS17055-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    105-PRS17054-12

    105-PRS17054-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,171
    RFQ
    105-PRS17054-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-600M35-001152

    550-10-600M35-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,831
    RFQ
    550-10-600M35-001152

    Tabla de datos

    550 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    191-PGM18015-10T

    191-PGM18015-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    3,640
    RFQ
    191-PGM18015-10T

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-PLS16016-12

    64-PLS16016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,707
    RFQ
    64-PLS16016-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    101-PRS14030-12

    101-PRS14030-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,615
    RFQ
    101-PRS14030-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    558-10-576M30-001101

    558-10-576M30-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    3,952
    RFQ
    558-10-576M30-001101

    Tabla de datos

    558 Bulk Active PGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-83-652M35-001148

    514-83-652M35-001148

    CONN SOCKET BGA 652POS GOLD

    Preci-Dip

    3,916
    RFQ
    514-83-652M35-001148

    Tabla de datos

    514 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3551-18

    28-3551-18

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    2,722
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    234-3034-02-0602

    234-3034-02-0602

    CONN ZIG-ZAG ZIF 34POS GOLD

    3M

    2,865
    RFQ
    234-3034-02-0602

    Tabla de datos

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    24-6574-18

    24-6574-18

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,159
    RFQ
    24-6574-18

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-560M33-001104

    558-10-560M33-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    4,199
    RFQ
    558-10-560M33-001104

    Tabla de datos

    558 Bulk Active BGA 560 (33 x 33) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-560M33-001105

    518-77-560M33-001105

    CONN SOCKET PGA 560POS GOLD

    Preci-Dip

    3,517
    RFQ
    518-77-560M33-001105

    Tabla de datos

    518 Bulk Active PGA 560 (33 x 33) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-600M35-001101

    558-10-600M35-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    2,989
    RFQ
    558-10-600M35-001101

    Tabla de datos

    558 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    168-PLS17011-12

    168-PLS17011-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,395
    RFQ
    168-PLS17011-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    172-PLS16002-12

    172-PLS16002-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,010
    RFQ
    172-PLS16002-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    24-6570-18

    24-6570-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    4,865
    RFQ
    24-6570-18

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    7010402515

    7010402515

    TEXTOOL1017-2-0252-0B-00L20 PP15

    3M

    4,291
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    518-77-560M33-001106

    518-77-560M33-001106

    CONN SOCKET PGA 560POS GOLD

    Preci-Dip

    4,861
    RFQ
    518-77-560M33-001106

    Tabla de datos

    518 Bulk Active PGA 560 (33 x 33) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    Total 19086 Record«Prev1... 902903904905906907908909...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios