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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    145-PRS15062-12

    145-PRS15062-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,890
    RFQ
    145-PRS15062-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    145-PLS15024-12

    145-PLS15024-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,845
    RFQ
    145-PLS15024-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    145-PRS15024-12

    145-PRS15024-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,555
    RFQ
    145-PRS15024-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    132-PRS14033-12

    132-PRS14033-12

    PGA ZIF TEST/BURN-IN SOCKET

    Aries Electronics

    4,242
    RFQ

    -

    PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
    268-6311-9UA-1902 GRID ZIP (11X11)

    268-6311-9UA-1902 GRID ZIP (11X11)

    TEXTOOL 268-6311-9UA-1902 PGA 11

    3M

    2,542
    RFQ

    -

    Textool™ Box Obsolete - - - - - - - - - - - - - - -
    HLS-1313-G-18

    HLS-1313-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,985
    RFQ
    HLS-1313-G-18

    Tabla de datos

    HLS Bulk Active SIP 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    558-10-600M35-001104

    558-10-600M35-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    4,300
    RFQ
    558-10-600M35-001104

    Tabla de datos

    558 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-600M35-001105

    518-77-600M35-001105

    CONN SOCKET PGA 600POS GOLD

    Preci-Dip

    4,545
    RFQ
    518-77-600M35-001105

    Tabla de datos

    518 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    32-6551-18

    32-6551-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    4,823
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    163-PRS15065-12

    163-PRS15065-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,481
    RFQ
    163-PRS15065-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    169-PLS17012-12

    169-PLS17012-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,937
    RFQ
    169-PLS17012-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    169-PRS17012-12

    169-PRS17012-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,238
    RFQ
    169-PRS17012-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    169-PRS17053-12

    169-PRS17053-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,382
    RFQ
    169-PRS17053-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    518-77-600M35-001106

    518-77-600M35-001106

    CONN SOCKET PGA 600POS GOLD

    Preci-Dip

    3,195
    RFQ
    518-77-600M35-001106

    Tabla de datos

    518 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-652M35-001101

    558-10-652M35-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    3,831
    RFQ
    558-10-652M35-001101

    Tabla de datos

    558 Bulk Active PGA 652 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    209-PRS17020-12

    209-PRS17020-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,569
    RFQ
    209-PRS17020-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7100265150

    7100265150

    TEXTOOLINTERSTITIAL PIN GRID ARR

    3M

    3,350
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    2100-6310-9UA-1902

    2100-6310-9UA-1902

    10X10 GRID ZIP SOCKET

    3M

    4,045
    RFQ

    -

    - Bulk Obsolete - 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    180-PRS18007-12

    180-PRS18007-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,175
    RFQ
    180-PRS18007-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    196-PRS14001-12

    196-PRS14001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,739
    RFQ
    196-PRS14001-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    Total 19086 Record«Prev1... 904905906907908909910911...955Next»
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