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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR16-HZL-TT

    AR16-HZL-TT

    CONN IC DIP SOCKET 16POS TIN

    Assmann WSW Components

    2,959
    RFQ
    AR16-HZL-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A48-LC-TR

    A48-LC-TR

    CONN IC DIP SOCKET 48POS TIN

    Assmann WSW Components

    4,712
    RFQ
    A48-LC-TR

    Tabla de datos

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    AW 127-15/Z-T

    AW 127-15/Z-T

    SOCKET 15 CONTACTS SINGLE ROW

    Assmann WSW Components

    3,682
    RFQ
    AW 127-15/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    116-87-304-41-003101

    116-87-304-41-003101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,273
    RFQ
    116-87-304-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-304-41-117101

    114-83-304-41-117101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,321
    RFQ
    114-83-304-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A 42-LC-TR

    A 42-LC-TR

    SOCKET

    Assmann WSW Components

    3,786
    RFQ

    -

    A Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    114-87-306-41-117101

    114-87-306-41-117101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,966
    RFQ
    114-87-306-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-306-41-134161

    114-87-306-41-134161

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,473
    RFQ
    114-87-306-41-134161

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X08-011B

    SIP1X08-011B

    SIP1X08-011B-SIP SOCKET 8 CTS

    Amphenol ICC (FCI)

    3,467
    RFQ
    SIP1X08-011B

    Tabla de datos

    SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    110-83-304-41-005101

    110-83-304-41-005101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,917
    RFQ
    110-83-304-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    01-0513-11

    01-0513-11

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    3,179
    RFQ
    01-0513-11

    Tabla de datos

    0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-1518-00

    02-1518-00

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    2,149
    RFQ
    02-1518-00

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-306-41-001101

    115-87-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,207
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL-TT

    AR 22-HZL-TT

    SOCKET

    Assmann WSW Components

    2,589
    RFQ

    -

    - Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AW 127-16/Z-T

    AW 127-16/Z-T

    SOCKET 16 CONTACTS SINGLE ROW

    Assmann WSW Components

    4,325
    RFQ
    AW 127-16/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    AR08-HZL/07-TT

    AR08-HZL/07-TT

    CONN IC DIP SOCKET 8POS GOLD

    Assmann WSW Components

    2,854
    RFQ
    AR08-HZL/07-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    HLS-0101-T-10

    HLS-0101-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,297
    RFQ
    HLS-0101-T-10

    Tabla de datos

    HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    SA1000300000G

    SA1000300000G

    SA-7.43- 10P ; CLIP:TIN200U" PI

    Amphenol Anytek

    3,925
    RFQ

    -

    SU Bulk Active SIP 10 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    02-0518-10H

    02-0518-10H

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    4,731
    RFQ
    02-0518-10H

    Tabla de datos

    518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0518-10T

    02-0518-10T

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,880
    RFQ
    02-0518-10T

    Tabla de datos

    518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 8283848586878889...955Next»
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