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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    ICA-632-ZAGG

    ICA-632-ZAGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,250
    RFQ
    ICA-632-ZAGG

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-47-318-41-006000

    116-47-318-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,351
    RFQ
    116-47-318-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-306-41-001000

    612-11-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,004
    RFQ
    612-11-306-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6511-11

    32-6511-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,970
    RFQ
    32-6511-11

    Tabla de datos

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    317-91-115-41-005000

    317-91-115-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    4,835
    RFQ
    317-91-115-41-005000

    Tabla de datos

    317 Bulk Active SIP 15 (1 x 15) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0310-G-11

    HLS-0310-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,267
    RFQ
    HLS-0310-G-11

    Tabla de datos

    HLS Tube Active SIP 27 (3 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    317-93-109-41-005000

    317-93-109-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    4,827
    RFQ
    317-93-109-41-005000

    Tabla de datos

    317 Tube Active SIP 9 (1 x 9) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-324-T-B

    APO-324-T-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,334
    RFQ
    APO-324-T-B

    Tabla de datos

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-41-314-41-003000

    116-41-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,189
    RFQ
    116-41-314-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-314-41-003000

    116-91-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,944
    RFQ
    116-91-314-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-320-41-006000

    116-47-320-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,153
    RFQ
    116-47-320-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-420-41-006000

    116-47-420-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,934
    RFQ
    116-47-420-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    88-PGM13041-10

    88-PGM13041-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,213
    RFQ
    88-PGM13041-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-0426-T-T

    APH-0426-T-T

    APH-0426-T-T

    Samtec Inc.

    2,261
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0926-T-T

    APH-0926-T-T

    APH-0926-T-T

    Samtec Inc.

    2,669
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0626-T-T

    APH-0626-T-T

    APH-0626-T-T

    Samtec Inc.

    4,560
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0826-T-T

    APH-0826-T-T

    APH-0826-T-T

    Samtec Inc.

    3,791
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    115-44-422-41-003000

    115-44-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,274
    RFQ
    115-44-422-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    25-0503-20

    25-0503-20

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,998
    RFQ
    25-0503-20

    Tabla de datos

    0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    50-9518-10H

    50-9518-10H

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,170
    RFQ
    50-9518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 508509510511512513514515...955Next»
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