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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    714-43-139-31-018000

    714-43-139-31-018000

    CONN SOCKET SIP 39POS GOLD

    Mill-Max Manufacturing Corp.

    2,231
    RFQ
    714-43-139-31-018000

    Tabla de datos

    714 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-314-41-007000

    116-47-314-41-007000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,926
    RFQ
    116-47-314-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-41-314-41-013000

    146-41-314-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    3,934
    RFQ
    146-41-314-41-013000

    Tabla de datos

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-314-41-013000

    146-91-314-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    2,893
    RFQ
    146-91-314-41-013000

    Tabla de datos

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-420-41-003000

    115-91-420-41-003000

    SOCKET IC OPEN LOWPRO .400 20POS

    Mill-Max Manufacturing Corp.

    3,665
    RFQ

    -

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-41-420-41-003000

    115-41-420-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,644
    RFQ
    115-41-420-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-308-41-001000

    121-11-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,224
    RFQ
    121-11-308-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    37-0508-20

    37-0508-20

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    2,188
    RFQ
    37-0508-20

    Tabla de datos

    508 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    37-0508-30

    37-0508-30

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    2,270
    RFQ
    37-0508-30

    Tabla de datos

    508 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-6621-30

    18-6621-30

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    2,788
    RFQ
    18-6621-30

    Tabla de datos

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    917-41-210-41-001000

    917-41-210-41-001000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,130
    RFQ
    917-41-210-41-001000

    Tabla de datos

    917 Tube Active Transistor, TO-100 10 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-328-41-003000

    115-47-328-41-003000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    3,286
    RFQ
    115-47-328-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-642-41-001000

    110-99-642-41-001000

    CONN IC DIP SOCKET 42POS TINLEAD

    Mill-Max Manufacturing Corp.

    2,040
    RFQ
    110-99-642-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-316-10-003000

    110-93-316-10-003000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    4,345
    RFQ
    110-93-316-10-003000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-308-31-018000

    614-93-308-31-018000

    SOCKET CARRIER LOWPRO .300 8POS

    Mill-Max Manufacturing Corp.

    4,602
    RFQ
    614-93-308-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-308-31-018000

    614-43-308-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,975
    RFQ
    614-43-308-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-324-STL-I

    ICF-324-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,065
    RFQ
    ICF-324-STL-I

    Tabla de datos

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-324-STL-O

    ICF-324-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,405
    RFQ
    ICF-324-STL-O

    Tabla de datos

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    26-0501-20

    26-0501-20

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    4,829
    RFQ
    26-0501-20

    Tabla de datos

    501 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    114-41-322-41-117000

    114-41-322-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,928
    RFQ
    114-41-322-41-117000

    Tabla de datos

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 510511512513514515516517...955Next»
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