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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    614-93-310-31-007000

    614-93-310-31-007000

    SOCKET CARRIER LOWPRO .300 10POS

    Mill-Max Manufacturing Corp.

    2,349
    RFQ
    614-93-310-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-210-41-001000

    123-41-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,596
    RFQ
    123-41-210-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-310-31-007000

    614-43-310-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,934
    RFQ
    614-43-310-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3551-10

    32-3551-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,882
    RFQ
    32-3551-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3552-10

    32-3552-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,608
    RFQ
    32-3552-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3553-10

    32-3553-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,393
    RFQ
    32-3553-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6552-10

    32-6552-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,141
    RFQ
    32-6552-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6553-10

    32-6553-10

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    4,530
    RFQ
    32-6553-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    317-91-114-41-005000

    317-91-114-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,222
    RFQ
    317-91-114-41-005000

    Tabla de datos

    317 Bulk Active SIP 14 (1 x 14) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-310-41-002000

    126-41-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,526
    RFQ
    126-41-310-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-310-41-002000

    126-91-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,960
    RFQ
    126-91-310-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0607-T-2-L

    HLS-0607-T-2-L

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,219
    RFQ
    HLS-0607-T-2-L

    Tabla de datos

    HLS Bulk Active SIP 42 (6 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APH-0524-T-R

    APH-0524-T-R

    APH-0524-T-R

    Samtec Inc.

    2,216
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0920-T-T

    APH-0920-T-T

    APH-0920-T-T

    Samtec Inc.

    2,427
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0924-T-R

    APH-0924-T-R

    APH-0924-T-R

    Samtec Inc.

    3,488
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1424-T-R

    APH-1424-T-R

    APH-1424-T-R

    Samtec Inc.

    2,155
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1520-T-T

    APH-1520-T-T

    APH-1520-T-T

    Samtec Inc.

    4,316
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0624-T-R

    APH-0624-T-R

    APH-0624-T-R

    Samtec Inc.

    4,112
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0220-T-T

    APH-0220-T-T

    APH-0220-T-T

    Samtec Inc.

    2,611
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0324-T-R

    APH-0324-T-R

    APH-0324-T-R

    Samtec Inc.

    4,721
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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