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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    510-83-241-18-071101

    510-83-241-18-071101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    2,428
    RFQ
    510-83-241-18-071101

    Tabla de datos

    510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-241-18-072101

    510-83-241-18-072101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    2,714
    RFQ
    510-83-241-18-072101

    Tabla de datos

    510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    104-13-308-41-780000

    104-13-308-41-780000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    4,288
    RFQ
    104-13-308-41-780000

    Tabla de datos

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    64-9513-11

    64-9513-11

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,294
    RFQ
    64-9513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-0508-21

    19-0508-21

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    2,610
    RFQ
    19-0508-21

    Tabla de datos

    508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    19-0508-31

    19-0508-31

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    4,166
    RFQ
    19-0508-31

    Tabla de datos

    508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    614-41-308-41-001000

    614-41-308-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,000
    RFQ
    614-41-308-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-308-41-001000

    614-91-308-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,506
    RFQ
    614-91-308-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-328-41-003000

    115-44-328-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,527
    RFQ
    115-44-328-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-628-41-003000

    115-44-628-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,116
    RFQ
    115-44-628-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-310-31-002000

    614-43-310-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,002
    RFQ
    614-43-310-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-310-31-002000

    614-93-310-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,662
    RFQ
    614-93-310-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0217-T-38

    HLS-0217-T-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,302
    RFQ
    HLS-0217-T-38

    Tabla de datos

    HLS Tube Active SIP 34 (2 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    111-41-324-41-001000

    111-41-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,522
    RFQ
    111-41-324-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-41-424-41-001000

    111-41-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,708
    RFQ
    111-41-424-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-41-624-41-001000

    111-41-624-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,971
    RFQ
    111-41-624-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-324-41-001000

    111-91-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,732
    RFQ
    111-91-324-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-424-41-001000

    111-91-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,743
    RFQ
    111-91-424-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-624-41-001000

    111-91-624-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,522
    RFQ
    111-91-624-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-210-41-001000

    123-91-210-41-001000

    SOCKET IC OPEN 3 LVL .200 10POS

    Mill-Max Manufacturing Corp.

    2,383
    RFQ

    -

    123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 505506507508509510511512...955Next»
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