Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    44-PGM08003-10

    44-PGM08003-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,993
    RFQ
    44-PGM08003-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-624-ZNGG

    ICO-624-ZNGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,710
    RFQ
    ICO-624-ZNGG

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    550-10-069-11-001101

    550-10-069-11-001101

    PGA SOLDER TAIL

    Preci-Dip

    3,570
    RFQ
    550-10-069-11-001101

    Tabla de datos

    550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-069-11-061101

    550-10-069-11-061101

    PGA SOLDER TAIL

    Preci-Dip

    4,720
    RFQ
    550-10-069-11-061101

    Tabla de datos

    550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-91-304-61-001000

    110-91-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,888
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-110-41-005000

    317-93-110-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,279
    RFQ
    317-93-110-41-005000

    Tabla de datos

    317 Tube Active SIP 10 (1 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-41-628-41-001000

    210-41-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,736
    RFQ
    210-41-628-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-91-628-41-001000

    210-91-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,842
    RFQ
    210-91-628-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-308-41-002000

    126-41-308-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,999
    RFQ
    126-41-308-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-308-41-002000

    126-91-308-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,473
    RFQ
    126-91-308-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-111-41-005000

    317-93-111-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,365
    RFQ
    317-93-111-41-005000

    Tabla de datos

    317 Bulk Active SIP 11 (1 x 11) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-310-41-001000

    116-41-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,407
    RFQ
    116-41-310-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-310-41-001000

    116-91-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,941
    RFQ
    116-91-310-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-232-17-061101

    510-83-232-17-061101

    CONN SOCKET PGA 232POS GOLD

    Preci-Dip

    2,483
    RFQ
    510-83-232-17-061101

    Tabla de datos

    510 Bulk Active PGA 232 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-99-210-12-001800

    299-99-210-12-001800

    CONN IC DIP SOCKET 10POS TINLEAD

    Mill-Max Manufacturing Corp.

    4,594
    RFQ
    299-99-210-12-001800

    Tabla de datos

    299 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-314-41-001000

    210-11-314-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,518
    RFQ
    210-11-314-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-310-31-012000

    614-93-310-31-012000

    SOCKET CARRIER LOWPRO .300 10POS

    Mill-Max Manufacturing Corp.

    3,807
    RFQ
    614-93-310-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-310-31-012000

    614-43-310-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,481
    RFQ
    614-43-310-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-0508-20

    30-0508-20

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    3,984
    RFQ
    30-0508-20

    Tabla de datos

    508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    114-93-314-41-117000

    114-93-314-41-117000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    4,476
    RFQ
    114-93-314-41-117000

    Tabla de datos

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 504505506507508509510511...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios