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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-43-310-41-008000

    116-43-310-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,379
    RFQ
    116-43-310-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-310-41-001000

    126-43-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,638
    RFQ
    126-43-310-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-308-41-001000

    116-41-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,053
    RFQ
    116-41-308-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-308-41-001000

    116-91-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,350
    RFQ
    116-91-308-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-308-31-018000

    614-41-308-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,593
    RFQ
    614-41-308-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-308-31-018000

    614-91-308-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,911
    RFQ
    614-91-308-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-93-320-41-001000

    210-93-320-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    4,781
    RFQ
    210-93-320-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-428-41-001000

    115-47-428-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,167
    RFQ
    115-47-428-41-001000

    Tabla de datos

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-636-41-001000

    110-99-636-41-001000

    CONN IC DIP SOCKET 36POS TINLEAD

    Mill-Max Manufacturing Corp.

    4,495
    RFQ
    110-99-636-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    85-PGM11007-10

    85-PGM11007-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,973
    RFQ
    85-PGM11007-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    111-41-322-41-001000

    111-41-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,377
    RFQ
    111-41-322-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-41-422-41-001000

    111-41-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,966
    RFQ
    111-41-422-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-322-41-001000

    111-91-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,703
    RFQ
    111-91-322-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-422-41-001000

    111-91-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,614
    RFQ
    111-91-422-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-87-127-16-091117

    514-87-127-16-091117

    CONN SOCKET PGA 127POS GOLD

    Preci-Dip

    2,965
    RFQ
    514-87-127-16-091117

    Tabla de datos

    514 Bulk Active PGA 127 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-11-314-41-001000

    110-11-314-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,981
    RFQ
    110-11-314-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-322-41-105000

    110-41-322-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,008
    RFQ
    110-41-322-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-422-41-105000

    110-41-422-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,100
    RFQ
    110-41-422-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-322-41-105000

    110-91-322-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,477
    RFQ
    110-91-322-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-422-41-105000

    110-91-422-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,085
    RFQ
    110-91-422-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 503504505506507508509510...955Next»
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