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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    SIP050-1X13-157B

    SIP050-1X13-157B

    1X13-157B-SIP SOCKET 13 CTS

    Amphenol ICC (FCI)

    4,790
    RFQ
    SIP050-1X13-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    110-87-424-41-001101

    110-87-424-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,437
    RFQ
    110-87-424-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-2513-10T

    06-2513-10T

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,819
    RFQ
    06-2513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-0518-00

    06-0518-00

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    2,778
    RFQ
    06-0518-00

    Tabla de datos

    518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-1518-00

    06-1518-00

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,436
    RFQ
    06-1518-00

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AR28-HZL/7/01-TT

    AR28-HZL/7/01-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    3,845
    RFQ

    -

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    116-83-306-41-002101

    116-83-306-41-002101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,916
    RFQ
    116-83-306-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP628-011B

    DIP628-011B

    DIP628-011B-DIP SOCKET 28 CTS

    Amphenol ICC (FCI)

    3,043
    RFQ
    DIP628-011B

    Tabla de datos

    - Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-87-310-41-012101

    116-87-310-41-012101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,471
    RFQ
    116-87-310-41-012101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-322-41-001151

    110-87-322-41-001151

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,223
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-0513-10T

    06-0513-10T

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,705
    RFQ
    06-0513-10T

    Tabla de datos

    0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    01-0503-21

    01-0503-21

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    2,854
    RFQ
    01-0503-21

    Tabla de datos

    0503 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    116-87-308-41-009101

    116-87-308-41-009101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,157
    RFQ
    116-87-308-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1814640-2

    1814640-2

    CONN IC DIP SOCKET 4POS GOLD

    TE Connectivity AMP Connectors

    4,222
    RFQ
    1814640-2

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Gold 5.00µin (0.127µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    614-87-314-41-001101

    614-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,640
    RFQ
    614-87-314-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-0503-20

    02-0503-20

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,532
    RFQ
    02-0503-20

    Tabla de datos

    0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    02-0503-30

    02-0503-30

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    4,740
    RFQ
    02-0503-30

    Tabla de datos

    0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    09-0518-10T

    09-0518-10T

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    2,103
    RFQ
    09-0518-10T

    Tabla de datos

    518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-1518-10

    10-1518-10

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,298
    RFQ
    10-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    A-CCS084-Z-SM/P

    A-CCS084-Z-SM/P

    SOCKET

    Assmann WSW Components

    2,180
    RFQ

    -

    - Bulk Active PLCC 84 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    Total 19086 Record«Prev1... 111112113114115116117118...955Next»
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