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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    917-87-104-41-005101

    917-87-104-41-005101

    CONN TRANSIST TO-5 4POS GOLD

    Preci-Dip

    3,284
    RFQ
    917-87-104-41-005101

    Tabla de datos

    917 Bulk Active Transistor, TO-5 4 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-87-104-41-053101

    917-87-104-41-053101

    CONN TRANSIST TO-5 4POS GOLD

    Preci-Dip

    2,926
    RFQ
    917-87-104-41-053101

    Tabla de datos

    917 Bulk Active Transistor, TO-5 4 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-310-41-003101

    115-83-310-41-003101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,778
    RFQ
    115-83-310-41-003101

    Tabla de datos

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-320-41-001101

    110-87-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,113
    RFQ
    110-87-320-41-001101

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP324-001B

    DIP324-001B

    DIP324-001B-DIP SOCKET 24 CTS

    Amphenol ICC (FCI)

    2,232
    RFQ
    DIP324-001B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    211-1-18-003

    211-1-18-003

    CONN IC DIP SOCKET 18POS GOLD

    CNC Tech

    2,820
    RFQ
    211-1-18-003

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    116-87-306-41-011101

    116-87-306-41-011101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,405
    RFQ
    116-87-306-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-87-312-41-001101

    612-87-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,568
    RFQ
    612-87-312-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-610-41-003101

    116-87-610-41-003101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,621
    RFQ
    116-87-610-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-0518-11

    06-0518-11

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,401
    RFQ
    06-0518-11

    Tabla de datos

    518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-1518-11

    06-1518-11

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,143
    RFQ
    06-1518-11

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0518-10T

    08-0518-10T

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    3,513
    RFQ
    08-0518-10T

    Tabla de datos

    518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-1518-10T

    08-1518-10T

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,135
    RFQ
    08-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    09-0518-10

    09-0518-10

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,138
    RFQ
    09-0518-10

    Tabla de datos

    518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    A-CCS052-Z-SM/P

    A-CCS052-Z-SM/P

    SOCKET

    Assmann WSW Components

    4,283
    RFQ

    -

    - Bulk Active PLCC 52 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    HLS-0101-G-2

    HLS-0101-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,002
    RFQ
    HLS-0101-G-2

    Tabla de datos

    HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    03-0513-11

    03-0513-11

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,160
    RFQ
    03-0513-11

    Tabla de datos

    0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    05-0513-10

    05-0513-10

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    2,796
    RFQ
    05-0513-10

    Tabla de datos

    0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    540-88-028-17-400

    540-88-028-17-400

    CONN SOCKET PLCC 28POS TIN

    Preci-Dip

    2,502
    RFQ
    540-88-028-17-400

    Tabla de datos

    540 Bulk Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    116-83-306-41-008101

    116-83-306-41-008101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,120
    RFQ
    116-83-306-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 107108109110111112113114...955Next»
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