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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    110-83-308-41-105161

    110-83-308-41-105161

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-308-41-105161

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AJ 52-LC

    AJ 52-LC

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    - Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    1051990001

    1051990001

    CONN CAM SOCKET 34POS GOLD

    Molex

    0
    RFQ
    1051990001

    Tabla de datos

    105199 Tape & Reel (TR) Obsolete Camera Socket 34 (2 x 8, 2 x 9) 0.024" (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024" (0.60mm) - - Copper Alloy Plastic -30°C ~ 85°C
    06-3518-10

    06-3518-10

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    0
    RFQ
    06-3518-10

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0518-10H

    08-0518-10H

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-0518-10H

    Tabla de datos

    518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-316-41-001101

    115-87-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-420-41-005101

    110-87-420-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-420-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-641602-4

    2-641602-4

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    2-641602-4

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic -55°C ~ 125°C
    917-83-104-41-005101

    917-83-104-41-005101

    CONN TRANSIST TO-5 4POS GOLD

    Preci-Dip

    0
    RFQ
    917-83-104-41-005101

    Tabla de datos

    917 Bulk Active Transistor, TO-5 4 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-210-01-742101

    110-83-210-01-742101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-210-01-742101

    Tabla de datos

    110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    231-44

    231-44

    CONN SOCKET PLCC 44POS GOLD

    CNC Tech

    0
    RFQ
    231-44

    Tabla de datos

    - Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    06-3513-10T

    06-3513-10T

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    0
    RFQ
    06-3513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    A-CCS20-G-R

    A-CCS20-G-R

    CONN SOCKET PLCC 20POS GOLD

    Assmann WSW Components

    0
    RFQ
    A-CCS20-G-R

    Tabla de datos

    - Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    AR24-HZL/7/01-TT

    AR24-HZL/7/01-TT

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    0
    RFQ

    -

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    SIP050-1X11-160B

    SIP050-1X11-160B

    1X11-160B-SIP SOCKET 11 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X11-160B

    Tabla de datos

    SIP050-1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR 42-HGL-TT

    AR 42-HGL-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    822473-4

    822473-4

    CONN SOCKET PLCC 44POS TIN-LEAD

    TE Connectivity AMP Connectors

    0
    RFQ
    822473-4

    Tabla de datos

    - Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Thermoplastic -
    115-87-318-41-001101

    115-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-312-41-005101

    110-83-312-41-005101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-312-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-312-41-018101

    116-87-312-41-018101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-312-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 110111112113114115116117...955Next»
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