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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    SIP1X17-001B

    SIP1X17-001B

    SIP1X17-001B-SIP SOCKET 17 CTS

    Amphenol ICC (FCI)

    2,674
    RFQ
    SIP1X17-001B

    Tabla de datos

    SIP1x Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    04-0513-11

    04-0513-11

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,152
    RFQ
    04-0513-11

    Tabla de datos

    0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    2-382714-1

    2-382714-1

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    2,738
    RFQ
    2-382714-1

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    1051631001

    1051631001

    SMIA65 CAMERA SOCKET CONTACT

    Molex

    2,234
    RFQ
    1051631001

    Tabla de datos

    105163 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) 0.037" (0.95mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.037" (0.95mm) Gold Flash Copper Alloy Thermoplastic -55°C ~ 85°C
    1051900001

    1051900001

    TOP-MOUNT CAMERA SOCKET FOR SMIA

    Molex

    3,957
    RFQ
    1051900001

    Tabla de datos

    105190 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) 0.033" (0.85mm) Gold 12.0µin (0.30µm) Phosphor Bronze Alloy Surface Mount Open Frame Solder 0.033" (0.85mm) Gold Flash Phosphor Bronze Alloy Thermoplastic -55°C ~ 85°C
    540-88-032-17-400

    540-88-032-17-400

    CONN SOCKET PLCC 32POS TIN

    Preci-Dip

    2,079
    RFQ
    540-88-032-17-400

    Tabla de datos

    540 Bulk Active PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    808-AG11D-ESL-LF

    808-AG11D-ESL-LF

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    2,528
    RFQ
    808-AG11D-ESL-LF

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    116-83-306-41-007101

    116-83-306-41-007101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,405
    RFQ
    116-83-306-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-316-41-003101

    115-87-316-41-003101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,439
    RFQ
    115-87-316-41-003101

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 24 HGL-TT

    AR 24 HGL-TT

    SOCKET

    Assmann WSW Components

    4,980
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 24 HGL/7-TT

    AR 24 HGL/7-TT

    SOCKET

    Assmann WSW Components

    3,579
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-87-320-41-005101

    110-87-320-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,959
    RFQ
    110-87-320-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-320-41-605101

    110-87-320-41-605101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,058
    RFQ
    110-87-320-41-605101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    233-84

    233-84

    CONN SOCKET PLCC 84POS TIN

    CNC Tech

    3,411
    RFQ
    233-84

    Tabla de datos

    - Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    3-382568-2

    3-382568-2

    CONN IC DIP SOCKET 32POS TIN

    TE Connectivity AMP Connectors

    2,880
    RFQ
    3-382568-2

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    614-83-308-31-012101

    614-83-308-31-012101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,169
    RFQ
    614-83-308-31-012101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-308-41-134191

    114-83-308-41-134191

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,205
    RFQ
    114-83-308-41-134191

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A22-LCG-T-R

    A22-LCG-T-R

    CONN IC DIP SOCKET 22POS GOLD

    Assmann WSW Components

    4,516
    RFQ
    A22-LCG-T-R

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    SIP050-1X10-160B

    SIP050-1X10-160B

    1X10-160B-SIP SOCKET 10 CTS

    Amphenol ICC (FCI)

    4,967
    RFQ
    SIP050-1X10-160B

    Tabla de datos

    SIP050-1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SU1210200000G

    SU1210200000G

    SU-2*6P RED ; 10.0MM CLIP PLATI

    Amphenol Anytek

    3,284
    RFQ

    -

    SU Bulk Active DIP, 0.1" (2.54mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    Total 19086 Record«Prev1... 109110111112113114115116...955Next»
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