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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    D01-9950642

    D01-9950642

    CONN SOCKET SIP 6POS GOLD

    Harwin Inc.

    3,011
    RFQ
    D01-9950642

    Tabla de datos

    D01-995 Tube Obsolete SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-312-41-003101

    116-87-312-41-003101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,778
    RFQ
    116-87-312-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-310-41-001101

    614-83-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,856
    RFQ
    614-83-310-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0102-G-10

    HLS-0102-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,944
    RFQ
    HLS-0102-G-10

    Tabla de datos

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    07-0518-11

    07-0518-11

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    2,153
    RFQ
    07-0518-11

    Tabla de datos

    518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    123-87-310-41-001101

    123-87-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,933
    RFQ
    123-87-310-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4-382568-0

    4-382568-0

    CONN IC DIP SOCKET 40POS TIN

    TE Connectivity AMP Connectors

    3,209
    RFQ
    4-382568-0

    Tabla de datos

    Diplomate DL Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    612-87-314-41-001101

    612-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,244
    RFQ
    612-87-314-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-306-41-004101

    116-87-306-41-004101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,595
    RFQ
    116-87-306-41-004101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-610-41-001101

    614-83-610-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,243
    RFQ
    614-83-610-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SMPX-20LCC-N-TR

    SMPX-20LCC-N-TR

    SMT PLCC 20P NON POLARISED, T&R

    Kycon, Inc.

    2,428
    RFQ
    SMPX-20LCC-N-TR

    Tabla de datos

    SMPX Tape & Reel (TR) Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    116-83-306-41-009101

    116-83-306-41-009101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,411
    RFQ
    116-83-306-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-318-41-117101

    114-87-318-41-117101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,774
    RFQ
    114-87-318-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D00-044-490-001

    D00-044-490-001

    CONN SOCKET PLCC 44POS TIN-LEAD

    EDAC Inc.

    2,633
    RFQ
    D00-044-490-001

    Tabla de datos

    D00 Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) - Surface Mount Closed Frame - - - - - - -
    110-83-310-41-105101

    110-83-310-41-105101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,846
    RFQ
    110-83-310-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS044-Z-SM/T

    A-CCS044-Z-SM/T

    SOCKET

    Assmann WSW Components

    4,331
    RFQ
    A-CCS044-Z-SM/T

    Tabla de datos

    - Bulk Active PLCC 44 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    SIP050-1X14-157B

    SIP050-1X14-157B

    1X14-157B-SIP SOCKET 14 CTS

    Amphenol ICC (FCI)

    2,116
    RFQ
    SIP050-1X14-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    03-0513-11H

    03-0513-11H

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    4,590
    RFQ
    03-0513-11H

    Tabla de datos

    0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0513-10H

    04-0513-10H

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    2,599
    RFQ
    04-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    01-0508-31

    01-0508-31

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    3,228
    RFQ
    01-0508-31

    Tabla de datos

    508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    Total 19086 Record«Prev1... 113114115116117118119120...955Next»
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