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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    441-PGG21001-40

    441-PGG21001-40

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    441-PGG21001-40

    Tabla de datos

    PGG Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    85-PRS11008-12

    85-PRS11008-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    85-PRS11008-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    2196-9026-01-2401

    2196-9026-01-2401

    TEXTOOL 2196-9026-01-2401 BGA OP

    3M

    0
    RFQ

    -

    Textool™ Box Obsolete - - - - - - - - - - - - - - -
    169-PLS13001-12

    169-PLS13001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    169-PLS13001-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    225-PGM15001-51

    225-PGM15001-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    225-PGM15001-51

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    96-PRS14024-12

    96-PRS14024-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    96-PRS14024-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    518-77-478M26-131106

    518-77-478M26-131106

    CONN SOCKET PGA 478POS GOLD

    Preci-Dip

    0
    RFQ
    518-77-478M26-131106

    Tabla de datos

    518 Bulk Active PGA 478 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-520M31-001101

    558-10-520M31-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    0
    RFQ
    558-10-520M31-001101

    Tabla de datos

    558 Bulk Active PGA 520 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    84-536-11

    84-536-11

    CONN SOCKET PLCC ZIF 84POS GOLD

    Aries Electronics

    0
    RFQ

    -

    536 - Obsolete PLCC, ZIF (ZIP) 84 (4 x 21) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    518-77-480M29-001106

    518-77-480M29-001106

    CONN SOCKET PGA 480POS GOLD

    Preci-Dip

    0
    RFQ
    518-77-480M29-001106

    Tabla de datos

    518 Bulk Active PGA 480 (29 x 29) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    56-PLS14031-12

    56-PLS14031-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    56-PLS14031-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    56-PRS14031-12

    56-PRS14031-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    56-PRS14031-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    44-6552-16

    44-6552-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    0
    RFQ
    44-6552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3554-16

    44-3554-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    0
    RFQ
    44-3554-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6553-16

    44-6553-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    0
    RFQ
    44-6553-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3551-16

    44-3551-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    0
    RFQ
    44-3551-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3552-16

    44-3552-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    0
    RFQ
    44-3552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3553-16

    44-3553-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    0
    RFQ
    44-3553-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6551-16

    44-6551-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    0
    RFQ
    44-6551-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6554-16

    44-6554-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    0
    RFQ
    44-6554-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 898899900901902903904905...955Next»
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