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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    614-93-304-31-002000

    614-93-304-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,024
    RFQ
    614-93-304-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-3518-112

    20-3518-112

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,938
    RFQ
    20-3518-112

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-3518-111

    24-3518-111

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,614
    RFQ
    24-3518-111

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-93-304-31-007000

    614-93-304-31-007000

    SOCKET CARRIER LOWPRO .300 4POS

    Mill-Max Manufacturing Corp.

    2,259
    RFQ
    614-93-304-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-304-31-007000

    614-43-304-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,455
    RFQ
    614-43-304-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-318-T-C

    APA-318-T-C

    ADAPTER PLUG

    Samtec Inc.

    4,493
    RFQ
    APA-318-T-C

    Tabla de datos

    APA Bulk Active - 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-318-T-C

    APO-318-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,100
    RFQ
    APO-318-T-C

    Tabla de datos

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-640-TL-O

    ICF-640-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,020
    RFQ
    ICF-640-TL-O

    Tabla de datos

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    09-0503-21

    09-0503-21

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    4,804
    RFQ
    09-0503-21

    Tabla de datos

    0503 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    40-6518-101

    40-6518-101

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,958
    RFQ
    40-6518-101

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-41-304-41-003000

    612-41-304-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,376
    RFQ
    612-41-304-41-003000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-304-41-003000

    612-91-304-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,008
    RFQ
    612-91-304-41-003000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-304-41-105000

    110-93-304-41-105000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    2,912
    RFQ
    110-93-304-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-304-31-018000

    614-93-304-31-018000

    SOCKET CARRIER LOWPRO .300 4POS

    Mill-Max Manufacturing Corp.

    3,536
    RFQ
    614-93-304-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-304-31-018000

    614-43-304-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,944
    RFQ
    614-43-304-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-83-624-10-002101

    299-83-624-10-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,110
    RFQ
    299-83-624-10-002101

    Tabla de datos

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-632-WTT

    ICA-632-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,720
    RFQ
    ICA-632-WTT

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    HLS-0208-G-22

    HLS-0208-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,270
    RFQ
    HLS-0208-G-22

    Tabla de datos

    HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-87-240-17-061101

    510-87-240-17-061101

    CONN SOCKET PGA 240POS GOLD

    Preci-Dip

    2,189
    RFQ
    510-87-240-17-061101

    Tabla de datos

    510 Bulk Active PGA 240 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-632-ATT

    ICO-632-ATT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,138
    RFQ
    ICO-632-ATT

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 369370371372373374375376...955Next»
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