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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    ICF-640-S-I-TR

    ICF-640-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,976
    RFQ
    ICF-640-S-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    614-41-304-31-007000

    614-41-304-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,851
    RFQ
    614-41-304-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-31-007000

    614-91-304-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,327
    RFQ
    614-91-304-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    2229490-2

    2229490-2

    CONN SOCKET PGA ZIF 947POS GOLD

    TE Connectivity AMP Connectors

    2,079
    RFQ
    2229490-2

    Tabla de datos

    - Tape & Reel (TR) Active PGA, ZIF (ZIP) 947 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic -
    HLS-0505-T-2

    HLS-0505-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,417
    RFQ
    HLS-0505-T-2

    Tabla de datos

    HLS Bulk Active SIP 25 (5 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    40-6518-10M

    40-6518-10M

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,849
    RFQ
    40-6518-10M

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-650-41-002101

    116-83-650-41-002101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,989
    RFQ
    116-83-650-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-208-17-081101

    510-87-208-17-081101

    CONN SOCKET PGA 208POS GOLD

    Preci-Dip

    4,401
    RFQ
    510-87-208-17-081101

    Tabla de datos

    510 Bulk Active PGA 208 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3511-11

    20-3511-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,035
    RFQ
    20-3511-11

    Tabla de datos

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0119-T-10

    HLS-0119-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,976
    RFQ
    HLS-0119-T-10

    Tabla de datos

    HLS Tube Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APH-1908-T-R

    APH-1908-T-R

    APH-1908-T-R

    Samtec Inc.

    2,771
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0408-T-R

    APH-0408-T-R

    APH-0408-T-R

    Samtec Inc.

    2,931
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0908-T-R

    APH-0908-T-R

    APH-0908-T-R

    Samtec Inc.

    4,342
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    510-87-236-17-062101

    510-87-236-17-062101

    CONN SOCKET PGA 236POS GOLD

    Preci-Dip

    4,915
    RFQ
    510-87-236-17-062101

    Tabla de datos

    510 Bulk Active PGA 236 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-41-304-31-018000

    614-41-304-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,549
    RFQ
    614-41-304-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-31-018000

    614-91-304-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,999
    RFQ
    614-91-304-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6518-112

    32-6518-112

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,350
    RFQ
    32-6518-112

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-316-AGG

    ICA-316-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,752
    RFQ
    ICA-316-AGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    XR2A-4001-N

    XR2A-4001-N

    CONN IC DIP SOCKET 40POS GOLD

    Omron Electronics Inc-EMC Div

    2,710
    RFQ
    XR2A-4001-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    ICO-322-LGG

    ICO-322-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,294
    RFQ
    ICO-322-LGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 366367368369370371372373...955Next»
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