Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    18-0503-30

    18-0503-30

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,374
    RFQ
    18-0503-30

    Tabla de datos

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    16-3508-201

    16-3508-201

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,209
    RFQ
    16-3508-201

    Tabla de datos

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-93-304-41-008000

    116-93-304-41-008000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    4,926
    RFQ
    116-93-304-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-304-41-008000

    116-43-304-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,000
    RFQ
    116-43-304-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0306-T-18

    HLS-0306-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,221
    RFQ
    HLS-0306-T-18

    Tabla de datos

    HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-43-640-31-012000

    614-43-640-31-012000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    2,108
    RFQ
    614-43-640-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-650-41-001101

    116-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,877
    RFQ
    116-83-650-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4-1437531-1

    4-1437531-1

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,059
    RFQ

    -

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
    ICF-322-SM-O

    ICF-322-SM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,663
    RFQ
    ICF-322-SM-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-S-I

    ICF-322-S-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,139
    RFQ
    ICF-322-S-I

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-83-132-13-002101

    510-83-132-13-002101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    4,704
    RFQ
    510-83-132-13-002101

    Tabla de datos

    510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-132-13-042101

    510-83-132-13-042101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    3,103
    RFQ
    510-83-132-13-042101

    Tabla de datos

    510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-320-T-P

    APA-320-T-P

    ADAPTER PLUG

    Samtec Inc.

    2,404
    RFQ
    APA-320-T-P

    Tabla de datos

    APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    18-3518-01

    18-3518-01

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,711
    RFQ
    18-3518-01

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-822-90

    16-822-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,345
    RFQ
    16-822-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    24-0517-90C

    24-0517-90C

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,590
    RFQ
    24-0517-90C

    Tabla de datos

    0517 Bulk Active SIP 24 (1 x 24) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-241-18-071101

    510-87-241-18-071101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    2,915
    RFQ
    510-87-241-18-071101

    Tabla de datos

    510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-241-18-072101

    510-87-241-18-072101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    4,808
    RFQ
    510-87-241-18-072101

    Tabla de datos

    510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-87-078-13-061117

    514-87-078-13-061117

    CONN SOCKET PGA 78POS GOLD

    Preci-Dip

    4,290
    RFQ
    514-87-078-13-061117

    Tabla de datos

    514 Bulk Active PGA 78 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-ZWGT-3

    ICA-624-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,028
    RFQ
    ICA-624-ZWGT-3

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 372373374375376377378379...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios