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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    ICO-422-LGG

    ICO-422-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,340
    RFQ
    ICO-422-LGG

    Tabla de datos

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-ZAGT

    ICO-320-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,817
    RFQ
    ICO-320-ZAGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    PGA132H004B1-1414R

    PGA132H004B1-1414R

    PGA SOCKET 132 CTS

    Amphenol ICC (FCI)

    3,064
    RFQ
    PGA132H004B1-1414R

    Tabla de datos

    - - Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    12-81250-610C

    12-81250-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,872
    RFQ
    12-81250-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-8260-610C

    12-8260-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,167
    RFQ
    12-8260-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-8300-610C

    12-8300-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,218
    RFQ
    12-8300-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    XR2T-2421-N

    XR2T-2421-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    3,589
    RFQ
    XR2T-2421-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Threaded Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    510-87-209-17-001101

    510-87-209-17-001101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    3,293
    RFQ
    510-87-209-17-001101

    Tabla de datos

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-209-17-062101

    510-87-209-17-062101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    3,697
    RFQ
    510-87-209-17-062101

    Tabla de datos

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-209-17-063101

    510-87-209-17-063101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    3,607
    RFQ
    510-87-209-17-063101

    Tabla de datos

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-237-17-061101

    510-87-237-17-061101

    CONN SOCKET PGA 237POS GOLD

    Preci-Dip

    4,942
    RFQ
    510-87-237-17-061101

    Tabla de datos

    510 Bulk Active PGA 237 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0207-G-32

    HLS-0207-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,886
    RFQ
    HLS-0207-G-32

    Tabla de datos

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0407-S-2

    HLS-0407-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,608
    RFQ
    HLS-0407-S-2

    Tabla de datos

    HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-41-304-41-001000

    614-41-304-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,383
    RFQ
    614-41-304-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-41-001000

    614-91-304-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,087
    RFQ
    614-91-304-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0117-G-10

    HLS-0117-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,288
    RFQ
    HLS-0117-G-10

    Tabla de datos

    HLS Tube Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    13-0503-20

    13-0503-20

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,181
    RFQ
    13-0503-20

    Tabla de datos

    0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    HLS-0306-T-12

    HLS-0306-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,040
    RFQ
    HLS-0306-T-12

    Tabla de datos

    HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    510-87-210-17-061101

    510-87-210-17-061101

    CONN SOCKET PGA 210POS GOLD

    Preci-Dip

    4,658
    RFQ
    510-87-210-17-061101

    Tabla de datos

    510 Bulk Active PGA 210 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-516-10

    28-516-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    3,168
    RFQ
    28-516-10

    Tabla de datos

    516 Bulk Obsolete DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 367368369370371372373374...955Next»
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