Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    ICO-422-LGG

    ICO-422-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,340
    RFQ
    ICO-422-LGG

    Tabla de datos

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-ZAGT

    ICO-320-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,817
    RFQ
    ICO-320-ZAGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    PGA132H004B1-1414R

    PGA132H004B1-1414R

    PGA SOCKET 132 CTS

    Amphenol ICC (FCI)

    3,064
    RFQ
    PGA132H004B1-1414R

    Tabla de datos

    - - Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    12-81250-610C

    12-81250-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,872
    RFQ
    12-81250-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-8260-610C

    12-8260-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,167
    RFQ
    12-8260-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-8300-610C

    12-8300-610C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,218
    RFQ
    12-8300-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    XR2T-2421-N

    XR2T-2421-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    3,589
    RFQ
    XR2T-2421-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Threaded Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    510-87-209-17-001101

    510-87-209-17-001101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    3,293
    RFQ
    510-87-209-17-001101

    Tabla de datos

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-209-17-062101

    510-87-209-17-062101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    3,697
    RFQ
    510-87-209-17-062101

    Tabla de datos

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-209-17-063101

    510-87-209-17-063101

    CONN SOCKET PGA 209POS GOLD

    Preci-Dip

    3,607
    RFQ
    510-87-209-17-063101

    Tabla de datos

    510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-237-17-061101

    510-87-237-17-061101

    CONN SOCKET PGA 237POS GOLD

    Preci-Dip

    4,942
    RFQ
    510-87-237-17-061101

    Tabla de datos

    510 Bulk Active PGA 237 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0207-G-32

    HLS-0207-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,886
    RFQ
    HLS-0207-G-32

    Tabla de datos

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0407-S-2

    HLS-0407-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,608
    RFQ
    HLS-0407-S-2

    Tabla de datos

    HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-41-304-41-001000

    614-41-304-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,383
    RFQ
    614-41-304-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-41-001000

    614-91-304-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,087
    RFQ
    614-91-304-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0117-G-10

    HLS-0117-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,288
    RFQ
    HLS-0117-G-10

    Tabla de datos

    HLS Tube Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    13-0503-20

    13-0503-20

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,181
    RFQ
    13-0503-20

    Tabla de datos

    0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    HLS-0306-T-12

    HLS-0306-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,040
    RFQ
    HLS-0306-T-12

    Tabla de datos

    HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    510-87-210-17-061101

    510-87-210-17-061101

    CONN SOCKET PGA 210POS GOLD

    Preci-Dip

    4,658
    RFQ
    510-87-210-17-061101

    Tabla de datos

    510 Bulk Active PGA 210 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-516-10

    28-516-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    3,168
    RFQ
    28-516-10

    Tabla de datos

    516 Bulk Obsolete DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 367368369370371372373374...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios