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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-83-640-41-007101

    116-83-640-41-007101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,229
    RFQ
    116-83-640-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-43-116-31-018000

    714-43-116-31-018000

    CONN SOCKET SIP 16POS GOLD

    Mill-Max Manufacturing Corp.

    2,104
    RFQ
    714-43-116-31-018000

    Tabla de datos

    714 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-314-ZAGG

    ICO-314-ZAGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,836
    RFQ
    ICO-314-ZAGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    20-3518-10E

    20-3518-10E

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,864
    RFQ
    20-3518-10E

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0303-G-18

    HLS-0303-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,814
    RFQ
    HLS-0303-G-18

    Tabla de datos

    HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-0501-30

    12-0501-30

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    3,479
    RFQ
    12-0501-30

    Tabla de datos

    501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-6501-30

    18-6501-30

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    3,953
    RFQ
    18-6501-30

    Tabla de datos

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-6513-10H

    20-6513-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,326
    RFQ
    20-6513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-4820-90C

    10-4820-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,772
    RFQ
    10-4820-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6820-90C

    10-6820-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,882
    RFQ
    10-6820-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6822-90C

    10-6822-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,095
    RFQ
    10-6822-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6823-90C

    10-6823-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,827
    RFQ
    10-6823-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0116-G-2

    HLS-0116-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,852
    RFQ
    HLS-0116-G-2

    Tabla de datos

    HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    32-6518-10H

    32-6518-10H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,778
    RFQ
    32-6518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-316-ZLGG

    ICO-316-ZLGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,334
    RFQ
    ICO-316-ZLGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0402-G-12

    HLS-0402-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,335
    RFQ
    HLS-0402-G-12

    Tabla de datos

    HLS Bulk Active SIP 8 (4 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICA-324-ZSGT-L

    ICA-324-ZSGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,674
    RFQ
    ICA-324-ZSGT-L

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    12-6823-90T

    12-6823-90T

    CONN IC DIP SOCKET 12POS TIN

    Aries Electronics

    4,366
    RFQ
    12-6823-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    10-6823-90TWR

    10-6823-90TWR

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    2,808
    RFQ
    10-6823-90TWR

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    18-0517-90C

    18-0517-90C

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    4,942
    RFQ
    18-0517-90C

    Tabla de datos

    0517 Bulk Active SIP 18 (1 x 18) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 319320321322323324325326...955Next»
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