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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    10-2501-21

    10-2501-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,199
    RFQ
    10-2501-21

    Tabla de datos

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-2501-31

    10-2501-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,831
    RFQ
    10-2501-31

    Tabla de datos

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-87-174-17-061101

    510-87-174-17-061101

    CONN SOCKET PGA 174POS GOLD

    Preci-Dip

    2,558
    RFQ
    510-87-174-17-061101

    Tabla de datos

    510 Bulk Active PGA 174 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-174-17-081101

    510-87-174-17-081101

    CONN SOCKET PGA 174POS GOLD

    Preci-Dip

    2,300
    RFQ
    510-87-174-17-081101

    Tabla de datos

    510 Bulk Active PGA 174 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-952-41-001101

    612-83-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,828
    RFQ
    612-83-952-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-ATT

    ICA-320-ATT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,235
    RFQ
    ICA-320-ATT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    510-87-180-14-031101

    510-87-180-14-031101

    CONN SOCKET PGA 180POS GOLD

    Preci-Dip

    2,692
    RFQ
    510-87-180-14-031101

    Tabla de datos

    510 Bulk Active PGA 180 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-T-12

    HLS-0112-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,756
    RFQ
    HLS-0112-T-12

    Tabla de datos

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-99-304-41-001000

    110-99-304-41-001000

    CONN IC DIP SOCKET 4POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    4,704
    RFQ
    110-99-304-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-640-41-009101

    116-83-640-41-009101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,249
    RFQ
    116-83-640-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0211-T-22

    HLS-0211-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,134
    RFQ
    HLS-0211-T-22

    Tabla de datos

    HLS Tube Active SIP 22 (2 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICA-318-WGT

    ICA-318-WGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,928
    RFQ
    ICA-318-WGT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZAGT

    ICA-318-ZAGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,234
    RFQ
    ICA-318-ZAGT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-ZAGT

    ICO-318-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,386
    RFQ
    ICO-318-ZAGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    31-0518-00

    31-0518-00

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    4,227
    RFQ
    31-0518-00

    Tabla de datos

    518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    8060-1G13

    8060-1G13

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    2,975
    RFQ
    8060-1G13

    Tabla de datos

    8060 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    40-6513-00

    40-6513-00

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,196
    RFQ
    40-6513-00

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6511-11

    08-6511-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,056
    RFQ
    08-6511-11

    Tabla de datos

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-83-642-41-008101

    116-83-642-41-008101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,694
    RFQ
    116-83-642-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-ZSGG

    ICO-314-ZSGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,297
    RFQ
    ICO-314-ZSGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 316317318319320321322323...955Next»
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