Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    10-2501-21

    10-2501-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,199
    RFQ
    10-2501-21

    Tabla de datos

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-2501-31

    10-2501-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,831
    RFQ
    10-2501-31

    Tabla de datos

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-87-174-17-061101

    510-87-174-17-061101

    CONN SOCKET PGA 174POS GOLD

    Preci-Dip

    2,558
    RFQ
    510-87-174-17-061101

    Tabla de datos

    510 Bulk Active PGA 174 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-174-17-081101

    510-87-174-17-081101

    CONN SOCKET PGA 174POS GOLD

    Preci-Dip

    2,300
    RFQ
    510-87-174-17-081101

    Tabla de datos

    510 Bulk Active PGA 174 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-952-41-001101

    612-83-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,828
    RFQ
    612-83-952-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-ATT

    ICA-320-ATT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,235
    RFQ
    ICA-320-ATT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    510-87-180-14-031101

    510-87-180-14-031101

    CONN SOCKET PGA 180POS GOLD

    Preci-Dip

    2,692
    RFQ
    510-87-180-14-031101

    Tabla de datos

    510 Bulk Active PGA 180 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-T-12

    HLS-0112-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,756
    RFQ
    HLS-0112-T-12

    Tabla de datos

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-99-304-41-001000

    110-99-304-41-001000

    CONN IC DIP SOCKET 4POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    4,704
    RFQ
    110-99-304-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-640-41-009101

    116-83-640-41-009101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,249
    RFQ
    116-83-640-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0211-T-22

    HLS-0211-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,134
    RFQ
    HLS-0211-T-22

    Tabla de datos

    HLS Tube Active SIP 22 (2 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICA-318-WGT

    ICA-318-WGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,928
    RFQ
    ICA-318-WGT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZAGT

    ICA-318-ZAGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,234
    RFQ
    ICA-318-ZAGT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-ZAGT

    ICO-318-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,386
    RFQ
    ICO-318-ZAGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    31-0518-00

    31-0518-00

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    4,227
    RFQ
    31-0518-00

    Tabla de datos

    518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    8060-1G13

    8060-1G13

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    2,975
    RFQ
    8060-1G13

    Tabla de datos

    8060 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    40-6513-00

    40-6513-00

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,196
    RFQ
    40-6513-00

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6511-11

    08-6511-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,056
    RFQ
    08-6511-11

    Tabla de datos

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-83-642-41-008101

    116-83-642-41-008101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,694
    RFQ
    116-83-642-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-ZSGG

    ICO-314-ZSGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,297
    RFQ
    ICO-314-ZSGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 316317318319320321322323...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios