Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APA-308-G-P

    APA-308-G-P

    ADAPTER PLUG

    Samtec Inc.

    2,283
    RFQ
    APA-308-G-P

    Tabla de datos

    APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-308-G-N

    APA-308-G-N

    ADAPTER PLUG

    Samtec Inc.

    3,591
    RFQ
    APA-308-G-N

    Tabla de datos

    APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-83-322-41-013101

    116-83-322-41-013101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,107
    RFQ
    116-83-322-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-422-41-013101

    116-83-422-41-013101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,763
    RFQ
    116-83-422-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-6513-10H

    14-6513-10H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,492
    RFQ
    14-6513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-83-324-11-001101

    299-83-324-11-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,174
    RFQ
    299-83-324-11-001101

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-422-SGT-L

    ICA-422-SGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,393
    RFQ
    ICA-422-SGT-L

    Tabla de datos

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-422-ZSGT

    ICO-422-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,441
    RFQ
    ICO-422-ZSGT

    Tabla de datos

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-632-CTT

    ICO-632-CTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,028
    RFQ
    ICO-632-CTT

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    HLS-0116-T-15

    HLS-0116-T-15

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,814
    RFQ
    HLS-0116-T-15

    Tabla de datos

    HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    510-83-100-10-000101

    510-83-100-10-000101

    CONN SOCKET PGA 100POS GOLD

    Preci-Dip

    3,985
    RFQ
    510-83-100-10-000101

    Tabla de datos

    510 Bulk Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-308-STL-O

    ICF-308-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,486
    RFQ
    ICF-308-STL-O

    Tabla de datos

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICO-320-ZMGT

    ICO-320-ZMGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,473
    RFQ
    ICO-320-ZMGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    299-87-622-10-002101

    299-87-622-10-002101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,907
    RFQ
    299-87-622-10-002101

    Tabla de datos

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-6513-11H

    18-6513-11H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,115
    RFQ
    18-6513-11H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-2810-90C

    08-2810-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,857
    RFQ
    08-2810-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-0511-10

    34-0511-10

    CONN SOCKET SIP 34POS TIN

    Aries Electronics

    3,935
    RFQ
    34-0511-10

    Tabla de datos

    511 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-318-MGT

    ICO-318-MGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,106
    RFQ
    ICO-318-MGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0209-T-30

    HLS-0209-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,728
    RFQ
    HLS-0209-T-30

    Tabla de datos

    HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    10-6503-20

    10-6503-20

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,316
    RFQ
    10-6503-20

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 320321322323324325326327...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios