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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-83-650-41-018101

    116-83-650-41-018101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,793
    RFQ
    116-83-650-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-6513-11

    30-6513-11

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,817
    RFQ
    30-6513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6518-111

    24-6518-111

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,707
    RFQ
    24-6518-111

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-640-T-I

    ICF-640-T-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,084
    RFQ
    ICF-640-T-I

    Tabla de datos

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    614-87-044-08-031112

    614-87-044-08-031112

    CONN SOCKET PGA 44POS GOLD

    Preci-Dip

    3,302
    RFQ
    614-87-044-08-031112

    Tabla de datos

    614 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0207-G-22

    HLS-0207-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,257
    RFQ
    HLS-0207-G-22

    Tabla de datos

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    614-93-328-31-012000

    614-93-328-31-012000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,380
    RFQ
    614-93-328-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-120-41-013000

    346-93-120-41-013000

    CONN SOCKET SIP 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,129
    RFQ
    346-93-120-41-013000

    Tabla de datos

    346 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-120-41-013000

    346-43-120-41-013000

    CONN SOCKET SIP 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,505
    RFQ
    346-43-120-41-013000

    Tabla de datos

    346 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-648-41-003101

    116-83-648-41-003101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,136
    RFQ
    116-83-648-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-8950-310C

    06-8950-310C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,167
    RFQ
    06-8950-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    XR2A-2801-N

    XR2A-2801-N

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    4,429
    RFQ
    XR2A-2801-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    510-83-096-11-041101

    510-83-096-11-041101

    CONN SOCKET PGA 96POS GOLD

    Preci-Dip

    4,640
    RFQ
    510-83-096-11-041101

    Tabla de datos

    510 Bulk Active PGA 96 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0511-10

    18-0511-10

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    4,911
    RFQ
    18-0511-10

    Tabla de datos

    511 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6823-90T

    14-6823-90T

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,637
    RFQ
    14-6823-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    510-87-175-16-001101

    510-87-175-16-001101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    2,452
    RFQ
    510-87-175-16-001101

    Tabla de datos

    510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-175-16-071101

    510-87-175-16-071101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    2,349
    RFQ
    510-87-175-16-071101

    Tabla de datos

    510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-175-16-072101

    510-87-175-16-072101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    2,392
    RFQ
    510-87-175-16-072101

    Tabla de datos

    510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8058-1G24

    8058-1G24

    CONN TRANSIST TO-5 4POS GOLD

    TE Connectivity AMP Connectors

    2,913
    RFQ
    8058-1G24

    Tabla de datos

    8058 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Panel Mount - Solder Cup - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    24-6518-101

    24-6518-101

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,387
    RFQ
    24-6518-101

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 315316317318319320321322...955Next»
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