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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    ICA-308-AGG

    ICA-308-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,228
    RFQ
    ICA-308-AGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    14-6503-20

    14-6503-20

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,038
    RFQ
    14-6503-20

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6503-30

    14-6503-30

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,508
    RFQ
    14-6503-30

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-324-WTT-2

    ICA-324-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,422
    RFQ
    ICA-324-WTT-2

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    3-1571586-2

    3-1571586-2

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    2,588
    RFQ
    3-1571586-2

    Tabla de datos

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    20-1518-11H

    20-1518-11H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,676
    RFQ
    20-1518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-320-SGG

    ICO-320-SGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,614
    RFQ
    ICO-320-SGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-ZLGT

    ICO-320-ZLGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,044
    RFQ
    ICO-320-ZLGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICF-628-F-O

    ICF-628-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,377
    RFQ
    ICF-628-F-O

    Tabla de datos

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-628-F-I

    ICF-628-F-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,756
    RFQ
    ICF-628-F-I

    Tabla de datos

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-328-F-O

    ICF-328-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,646
    RFQ
    ICF-328-F-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-328-S-I-TR

    ICF-328-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,964
    RFQ
    ICF-328-S-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    16-823-90T

    16-823-90T

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    2,878
    RFQ
    16-823-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    510-87-175-15-061101

    510-87-175-15-061101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    3,503
    RFQ
    510-87-175-15-061101

    Tabla de datos

    510 Bulk Active PGA 175 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-642-41-002101

    116-83-642-41-002101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,878
    RFQ
    116-83-642-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-172-16-001101

    510-87-172-16-001101

    CONN SOCKET PGA 172POS GOLD

    Preci-Dip

    3,883
    RFQ
    510-87-172-16-001101

    Tabla de datos

    510 Bulk Active PGA 172 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-652-41-006101

    116-83-652-41-006101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,781
    RFQ
    116-83-652-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-648-41-008101

    116-87-648-41-008101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,255
    RFQ
    116-87-648-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PGA101H012B1-1321R

    PGA101H012B1-1321R

    PGA SOCKET 101 CTS

    Amphenol ICC (FCI)

    2,932
    RFQ

    -

    - - Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
    612-87-964-41-001101

    612-87-964-41-001101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    2,894
    RFQ
    612-87-964-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 313314315316317318319320...955Next»
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