Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    30-0518-00

    30-0518-00

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    2,433
    RFQ
    30-0518-00

    Tabla de datos

    518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    30-1518-00

    30-1518-00

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,140
    RFQ
    30-1518-00

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-81250-610C

    08-81250-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,403
    RFQ
    08-81250-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-8305-610C

    08-8305-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,594
    RFQ
    08-8305-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-87-650-41-009101

    116-87-650-41-009101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,760
    RFQ
    116-87-650-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-169-17-101101

    510-87-169-17-101101

    CONN SOCKET PGA 169POS GOLD

    Preci-Dip

    2,014
    RFQ
    510-87-169-17-101101

    Tabla de datos

    510 Bulk Active PGA 169 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-636-41-001101

    116-83-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    2,797
    RFQ
    116-83-636-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-ZWGT-3

    ICA-314-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,941
    RFQ
    ICA-314-ZWGT-3

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0405-S-2

    HLS-0405-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,315
    RFQ
    HLS-0405-S-2

    Tabla de datos

    HLS Bulk Active SIP 20 (4 x 5) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    28-6518-10M

    28-6518-10M

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,751
    RFQ
    28-6518-10M

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-71000-10

    08-71000-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    2,808
    RFQ
    08-71000-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-71250-10

    08-71250-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    3,787
    RFQ
    08-71250-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-7350-10

    08-7350-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    2,513
    RFQ
    08-7350-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-7350-11

    08-7350-11

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    2,203
    RFQ
    08-7350-11

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-7360-10

    08-7360-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    4,480
    RFQ
    08-7360-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-7390-10

    08-7390-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    4,789
    RFQ
    08-7390-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-7400-10

    08-7400-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    2,503
    RFQ
    08-7400-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-7425-10

    08-7425-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    2,149
    RFQ
    08-7425-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-7430-10

    08-7430-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    4,237
    RFQ
    08-7430-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-7445-10

    08-7445-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    3,738
    RFQ
    08-7445-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 311312313314315316317318...955Next»
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios