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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    05-0503-20

    05-0503-20

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    2,812
    RFQ
    05-0503-20

    Tabla de datos

    0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    05-0503-30

    05-0503-30

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,984
    RFQ
    05-0503-30

    Tabla de datos

    0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    12-0518-00

    12-0518-00

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,483
    RFQ
    12-0518-00

    Tabla de datos

    518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0518-11

    17-0518-11

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,461
    RFQ
    17-0518-11

    Tabla de datos

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    21-0518-10H

    21-0518-10H

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    4,858
    RFQ
    21-0518-10H

    Tabla de datos

    518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-0508-20

    06-0508-20

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    2,904
    RFQ
    06-0508-20

    Tabla de datos

    508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-0508-30

    06-0508-30

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    3,947
    RFQ
    06-0508-30

    Tabla de datos

    508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-1508-20

    06-1508-20

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,023
    RFQ
    06-1508-20

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-1508-30

    06-1508-30

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,273
    RFQ
    06-1508-30

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    116-83-420-41-006101

    116-83-420-41-006101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,297
    RFQ
    116-83-420-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-328-41-005101

    110-83-328-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,665
    RFQ
    110-83-328-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-640-41-001101

    115-87-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,436
    RFQ

    -

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-320-41-002101

    116-87-320-41-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,184
    RFQ
    116-87-320-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-308-F-O

    ICF-308-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,609
    RFQ
    ICF-308-F-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-308-F-I

    ICF-308-F-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,497
    RFQ
    ICF-308-F-I

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    114-83-424-41-117101

    114-83-424-41-117101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,657
    RFQ
    114-83-424-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0106-T-10

    HLS-0106-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,792
    RFQ
    HLS-0106-T-10

    Tabla de datos

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-318-41-002101

    116-87-318-41-002101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,991
    RFQ
    116-87-318-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-316-41-007101

    116-83-316-41-007101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,576
    RFQ
    116-83-316-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-428-41-005101

    110-83-428-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,909
    RFQ
    110-83-428-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 169170171172173174175176...955Next»
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