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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-87-424-41-003101

    116-87-424-41-003101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,138
    RFQ
    116-87-424-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-3511-10WR

    16-3511-10WR

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    3,950
    RFQ
    16-3511-10WR

    Tabla de datos

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    SIP050-1X25-160B

    SIP050-1X25-160B

    1X25-160B-SIP SOCKET 25 CTS

    Amphenol ICC (FCI)

    2,333
    RFQ
    SIP050-1X25-160B

    Tabla de datos

    SIP050-1x Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    121-83-316-41-001101

    121-83-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,820
    RFQ
    121-83-316-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X32-157B

    SIP050-1X32-157B

    1X32-157B-SIP SOCKET 32 CTS

    Amphenol ICC (FCI)

    4,098
    RFQ
    SIP050-1X32-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-87-318-41-009101

    116-87-318-41-009101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,028
    RFQ
    116-87-318-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C8114-04

    C8114-04

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,846
    RFQ
    C8114-04

    Tabla de datos

    Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-4513-10H

    08-4513-10H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,147
    RFQ
    08-4513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2513-11

    10-2513-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,195
    RFQ
    10-2513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0513-10

    17-0513-10

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,539
    RFQ
    17-0513-10

    Tabla de datos

    0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-0518-10T

    22-0518-10T

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    4,108
    RFQ
    22-0518-10T

    Tabla de datos

    518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0518-10

    24-0518-10

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,924
    RFQ
    24-0518-10

    Tabla de datos

    518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-320-41-105161

    110-83-320-41-105161

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,293
    RFQ
    110-83-320-41-105161

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-624-41-005101

    117-83-624-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,695
    RFQ
    117-83-624-41-005101

    Tabla de datos

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 50-HZL/01-TT

    AR 50-HZL/01-TT

    SOCKET

    Assmann WSW Components

    2,596
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICA-308-ZSST

    ICA-308-ZSST

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,895
    RFQ
    ICA-308-ZSST

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    124-83-312-41-002101

    124-83-312-41-002101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,687
    RFQ

    -

    124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-0513-11

    08-0513-11

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    3,746
    RFQ
    08-0513-11

    Tabla de datos

    0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-314-41-009101

    116-83-314-41-009101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,672
    RFQ
    116-83-314-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-420-41-001101

    612-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,123
    RFQ
    612-83-420-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 166167168169170171172173...955Next»
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