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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    210748-5

    210748-5

    CONN SOCKET PGA 6POS TIN-LEAD

    TE Connectivity AMP Connectors

    3,722
    RFQ
    210748-5

    Tabla de datos

    - Tube Obsolete PGA 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 196.9µin (5.00µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic, Polyester, Glass Filled -
    BU320Z

    BU320Z

    CONN IC DIP SOCKET 32POS

    On Shore Technology Inc.

    4,040
    RFQ

    -

    BU - Active - 32 (2 x 16) - - - - - - - - - - - - -
    116-87-624-41-006101

    116-87-624-41-006101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,032
    RFQ
    116-87-624-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-9513-10T

    06-9513-10T

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,043
    RFQ
    06-9513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-0513-10H

    12-0513-10H

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    4,117
    RFQ
    12-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-1518-10H

    20-1518-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,457
    RFQ
    20-1518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-1518-10T

    22-1518-10T

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,934
    RFQ
    22-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-1518-10

    24-1518-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,300
    RFQ
    24-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0104-G-11

    HLS-0104-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,698
    RFQ
    HLS-0104-G-11

    Tabla de datos

    HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    SIP050-1X29-157B

    SIP050-1X29-157B

    1X29-157B-SIP SOCKET 29 CTS

    Amphenol ICC (FCI)

    3,590
    RFQ
    SIP050-1X29-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    540-88-052-24-008

    540-88-052-24-008

    CONN SOCKET PLCC 52POS TIN

    Preci-Dip

    4,857
    RFQ
    540-88-052-24-008

    Tabla de datos

    540 Bulk Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    HLS-0401-T-2

    HLS-0401-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,514
    RFQ
    HLS-0401-T-2

    Tabla de datos

    HLS Bulk Active SIP 4 (4 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-2004-T-10

    HLS-2004-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    5,000
    RFQ
    HLS-2004-T-10

    Tabla de datos

    HLS Bulk Active SIP 80 (20 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    115-83-624-41-003101

    115-83-624-41-003101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,457
    RFQ
    115-83-624-41-003101

    Tabla de datos

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-320-41-006101

    116-83-320-41-006101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,285
    RFQ
    116-83-320-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D0820-01

    D0820-01

    CONN IC DIP SOCKET 20POS GOLD

    Harwin Inc.

    4,053
    RFQ
    D0820-01

    Tabla de datos

    D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    516-AG10D-ESL

    516-AG10D-ESL

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,411
    RFQ
    516-AG10D-ESL

    Tabla de datos

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
    HLS-0104-T-12

    HLS-0104-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,898
    RFQ
    HLS-0104-T-12

    Tabla de datos

    HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    510-87-052-09-041101

    510-87-052-09-041101

    CONN SOCKET PGA 52POS GOLD

    Preci-Dip

    4,255
    RFQ
    510-87-052-09-041101

    Tabla de datos

    510 Bulk Active PGA 52 (9 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0104-T-18

    HLS-0104-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,581
    RFQ
    HLS-0104-T-18

    Tabla de datos

    HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    Total 19086 Record«Prev1... 165166167168169170171172...955Next»
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