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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR 52-HZL/01-TT

    AR 52-HZL/01-TT

    SOCKET

    Assmann WSW Components

    3,760
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    BU220Z-178-HT

    BU220Z-178-HT

    CONN IC DIP SOCKET 22POS GOLD

    On Shore Technology Inc.

    4,821
    RFQ
    BU220Z-178-HT

    Tabla de datos

    BU-178HT Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    AR 64-HZL-TT

    AR 64-HZL-TT

    CONN IC DIP SOCKET 64POS TIN

    Assmann WSW Components

    4,822
    RFQ
    AR 64-HZL-TT

    Tabla de datos

    - Tray Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    ICF-314-TM-O

    ICF-314-TM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,647
    RFQ
    ICF-314-TM-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-314-T-I

    ICF-314-T-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,770
    RFQ
    ICF-314-T-I

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    4620

    4620

    CONN TRANSIST TO-3 3POS TIN

    Keystone Electronics

    2,909
    RFQ
    4620

    Tabla de datos

    - Bulk Obsolete Transistor, TO-3 3 (Rectangular) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    540-44-044-24-000000

    540-44-044-24-000000

    CONN SOCKET PLCC 44POS TIN

    Mill-Max Manufacturing Corp.

    4,237
    RFQ
    540-44-044-24-000000

    Tabla de datos

    540 Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    06-6513-10H

    06-6513-10H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,457
    RFQ
    06-6513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-0513-11

    11-0513-11

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    4,573
    RFQ
    11-0513-11

    Tabla de datos

    0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0518-10T

    23-0518-10T

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,494
    RFQ
    23-0518-10T

    Tabla de datos

    518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    212-1-16-003

    212-1-16-003

    CONN IC DIP SOCKET 16POS GOLD

    CNC Tech

    3,752
    RFQ
    212-1-16-003

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    HLS-0114-TT-2

    HLS-0114-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,275
    RFQ
    HLS-0114-TT-2

    Tabla de datos

    HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    614-87-432-41-001101

    614-87-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,122
    RFQ
    614-87-432-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-87-310-11-001101

    299-87-310-11-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,783
    RFQ
    299-87-310-11-001101

    Tabla de datos

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-328-41-001101

    115-83-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,550
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-87-320-41-001101

    122-87-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,399
    RFQ
    122-87-320-41-001101

    Tabla de datos

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-422-41-001101

    123-87-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,346
    RFQ
    123-87-422-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-314-T-J

    APO-314-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,534
    RFQ
    APO-314-T-J

    Tabla de datos

    APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    D0818-01

    D0818-01

    CONN IC DIP SOCKET 18POS GOLD

    Harwin Inc.

    2,631
    RFQ
    D0818-01

    Tabla de datos

    D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SMPX-68LCC-P

    SMPX-68LCC-P

    SMT PLCC SOCKET 68P POLARISED RO

    Kycon, Inc.

    3,556
    RFQ
    SMPX-68LCC-P

    Tabla de datos

    SMPX Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    Total 19086 Record«Prev1... 171172173174175176177178...955Next»
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