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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR 42-HZL/01-TT

    AR 42-HZL/01-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-87-316-41-008101

    116-87-316-41-008101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-316-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-6518-10T

    28-6518-10T

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-6518-10T

    Tabla de datos

    518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    5-1437529-9

    5-1437529-9

    CONN IC DIP SOCKET 4POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ

    -

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Thermoplastic, Polyester -55°C ~ 125°C
    SIP050-1X25-157B

    SIP050-1X25-157B

    1X25-157B-SIP SOCKET 25 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X25-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    122-87-318-41-001101

    122-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    0
    RFQ
    122-87-318-41-001101

    Tabla de datos

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-318-41-001101

    123-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    0
    RFQ
    123-87-318-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0103-G-12

    HLS-0103-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0103-G-12

    Tabla de datos

    HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    612-87-624-41-001101

    612-87-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    612-87-624-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-001101

    116-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-314-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-0518-11H

    08-0518-11H

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-0518-11H

    Tabla de datos

    518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-1518-11H

    08-1518-11H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-1518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-1518-11

    14-1518-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-1518-11

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0518-10H

    17-0518-10H

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    0
    RFQ
    17-0518-10H

    Tabla de datos

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-318-41-105101

    110-83-318-41-105101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-318-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL/07-TT

    AR 22-HZL/07-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICO-308-STT-L

    ICO-308-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-308-STT-L

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-310-41-011101

    116-83-310-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-310-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-322-41-003101

    116-87-322-41-003101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-322-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-83-314-41-001101

    122-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    122-83-314-41-001101

    Tabla de datos

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 152153154155156157158159...955Next»
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