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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    C9108-00

    C9108-00

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    C9108-00

    Tabla de datos

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-0513-10

    14-0513-10

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-0513-10

    Tabla de datos

    0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-1518-10

    20-1518-10

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    114-87-328-41-134191

    114-87-328-41-134191

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    114-87-328-41-134191

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-316-41-001101

    612-83-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    612-83-316-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-324-41-105161

    110-87-324-41-105161

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-324-41-105161

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-024-050

    110-024-050

    CONN IC DIP SOCKET 24POS GOLD

    3M

    0
    RFQ
    110-024-050

    Tabla de datos

    100 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    A-ICS-254-12-TT50

    A-ICS-254-12-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    0
    RFQ
    A-ICS-254-12-TT50

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-83-314-41-105191

    110-83-314-41-105191

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-83-310-41-002101

    124-83-310-41-002101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ

    -

    124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A48-LCG-T-R

    A48-LCG-T-R

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    0
    RFQ
    A48-LCG-T-R

    Tabla de datos

    - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    16-3511-10

    16-3511-10

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    0
    RFQ
    16-3511-10

    Tabla de datos

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    4603

    4603

    CONN TRANSIST TO-3 3POS TIN

    Keystone Electronics

    0
    RFQ
    4603

    Tabla de datos

    - Bulk Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    3-822516-7

    3-822516-7

    CONN SOCKET PLCC 32POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ
    3-822516-7

    Tabla de datos

    - Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    D2922-42

    D2922-42

    CONN IC DIP SOCKET 22POS GOLD

    Harwin Inc.

    0
    RFQ
    D2922-42

    Tabla de datos

    D2 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    299-87-308-11-001101

    299-87-308-11-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ
    299-87-308-11-001101

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-210-41-011101

    116-87-210-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-210-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-324-41-006101

    116-87-324-41-006101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-324-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-83-220-10-001101

    410-83-220-10-001101

    CONN ZIG-ZAG 20POS GOLD

    Preci-Dip

    0
    RFQ
    410-83-220-10-001101

    Tabla de datos

    410 Bulk Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-83-220-10-002101

    410-83-220-10-002101

    CONN ZIG-ZAG 20POS GOLD

    Preci-Dip

    0
    RFQ
    410-83-220-10-002101

    Tabla de datos

    410 Bulk Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 150151152153154155156157...955Next»
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