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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-83-312-41-008101

    116-83-312-41-008101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,328
    RFQ
    116-83-312-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-312-41-035101

    146-83-312-41-035101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,798
    RFQ
    146-83-312-41-035101

    Tabla de datos

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-312-41-036101

    146-83-312-41-036101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,007
    RFQ
    146-83-312-41-036101

    Tabla de datos

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-322-41-001101

    115-83-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,640
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-83-208-41-053101

    917-83-208-41-053101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    4,179
    RFQ
    917-83-208-41-053101

    Tabla de datos

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-632-41-001101

    115-87-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,975
    RFQ

    -

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-420-41-003101

    116-87-420-41-003101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,335
    RFQ
    116-87-420-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-424-41-105101

    110-87-424-41-105101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,752
    RFQ
    110-87-424-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-422-41-001101

    115-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,755
    RFQ

    -

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-624-41-001151

    110-83-624-41-001151

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,520
    RFQ

    -

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-420-41-006101

    116-87-420-41-006101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,336
    RFQ
    116-87-420-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0102-G-3

    HLS-0102-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,118
    RFQ
    HLS-0102-G-3

    Tabla de datos

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    D2948-42

    D2948-42

    CONN IC DIP SOCKET 48POS GOLD

    Harwin Inc.

    3,584
    RFQ
    D2948-42

    Tabla de datos

    D2 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    BU080Z-178-HT

    BU080Z-178-HT

    CONN IC DIP SOCKET 8POS GOLD

    On Shore Technology Inc.

    3,565
    RFQ
    BU080Z-178-HT

    Tabla de datos

    BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    400-032-000

    400-032-000

    CONN IC DIP SOCKET 32POS GOLD

    3M

    2,075
    RFQ

    -

    400 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    116-83-316-41-018101

    116-83-316-41-018101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,679
    RFQ
    116-83-316-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-049-07-000101

    510-87-049-07-000101

    CONN SOCKET PGA 49POS GOLD

    Preci-Dip

    4,169
    RFQ
    510-87-049-07-000101

    Tabla de datos

    510 Bulk Active PGA 49 (7 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-87-308-10-001101

    299-87-308-10-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,806
    RFQ
    299-87-308-10-001101

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-3513-00

    08-3513-00

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,522
    RFQ
    08-3513-00

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    4608

    4608

    CONN TRANSIST TO-3 3POS TIN

    Keystone Electronics

    4,196
    RFQ
    4608

    Tabla de datos

    - Bulk Active Transistor, TO-3 3 (Rectangular) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    Total 19086 Record«Prev1... 149150151152153154155156...955Next»
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