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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    110-87-636-41-005101

    110-87-636-41-005101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,408
    RFQ
    110-87-636-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X23-157B

    SIP050-1X23-157B

    1X23-157B-SIP SOCKET 23 CTS

    Amphenol ICC (FCI)

    2,883
    RFQ
    SIP050-1X23-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-87-312-41-011101

    116-87-312-41-011101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    2,191
    RFQ
    116-87-312-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    12-3513-10T

    12-3513-10T

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,311
    RFQ
    12-3513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-87-324-41-001101

    612-87-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,981
    RFQ
    612-87-324-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-422-41-005101

    110-83-422-41-005101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,970
    RFQ
    110-83-422-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-422-41-605101

    110-83-422-41-605101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,906
    RFQ
    110-83-422-41-605101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-322-41-018101

    116-87-322-41-018101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,622
    RFQ
    116-87-322-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0103-G-38

    HLS-0103-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,393
    RFQ
    HLS-0103-G-38

    Tabla de datos

    HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    211-1-40-006

    211-1-40-006

    CONN IC DIP SOCKET 40POS GOLD

    CNC Tech

    3,094
    RFQ
    211-1-40-006

    Tabla de datos

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    122-83-312-41-001101

    122-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,296
    RFQ
    122-83-312-41-001101

    Tabla de datos

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    643647-1

    643647-1

    CONN SOCKET SIP 15POS TIN

    TE Connectivity AMP Connectors

    2,197
    RFQ
    643647-1

    Tabla de datos

    Diplomate DL Tray Obsolete SIP 15 (1 x 15) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    510-83-028-06-001101

    510-83-028-06-001101

    CONN SOCKET PGA 28POS GOLD

    Preci-Dip

    2,099
    RFQ
    510-83-028-06-001101

    Tabla de datos

    510 Bulk Active PGA 28 (6 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    643653-1

    643653-1

    CONN SOCKET SIP 21POS TIN

    TE Connectivity AMP Connectors

    4,907
    RFQ

    -

    Diplomate DL Box Obsolete SIP 21 (1 x 21) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    110-87-320-41-105191

    110-87-320-41-105191

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,232
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    822516-5

    822516-5

    CONN SOCKET PLCC 68POS TIN

    TE Connectivity AMP Connectors

    4,439
    RFQ
    822516-5

    Tabla de datos

    - Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    114-83-316-41-134191

    114-83-316-41-134191

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,497
    RFQ
    114-83-316-41-134191

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    808-AG11D

    808-AG11D

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,170
    RFQ
    808-AG11D

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    2-1571550-3

    2-1571550-3

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    2,357
    RFQ
    2-1571550-3

    Tabla de datos

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    508-AG10D-ES

    508-AG10D-ES

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,280
    RFQ
    508-AG10D-ES

    Tabla de datos

    500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 148149150151152153154155...955Next»
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