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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    123-87-308-41-001101

    123-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,318
    RFQ
    123-87-308-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-316-41-605101

    110-87-316-41-605101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,107
    RFQ
    110-87-316-41-605101

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-610-41-005101

    110-83-610-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,583
    RFQ
    110-83-610-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    03-0513-10H

    03-0513-10H

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,591
    RFQ
    03-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-314-41-001101

    115-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,208
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ED028PLCZ-SM-N

    ED028PLCZ-SM-N

    CONN SOCKET PLCC 28POS

    On Shore Technology Inc.

    3,267
    RFQ
    ED028PLCZ-SM-N

    Tabla de datos

    ED Tube Active PLCC 28 (2 x 14) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
    822499-1

    822499-1

    CONN SOCKET PLCC 44POS TIN-LEAD

    TE Connectivity AMP Connectors

    4,713
    RFQ
    822499-1

    Tabla de datos

    - Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Thermoplastic -
    AR 36-HGL-TT

    AR 36-HGL-TT

    SOCKET

    Assmann WSW Components

    2,762
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    DIP328-011B

    DIP328-011B

    DIP328-011B-DIP SOCKET 28 CTS

    Amphenol ICC (FCI)

    3,674
    RFQ
    DIP328-011B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR 52-HZL-TT

    AR 52-HZL-TT

    SOCKET

    Assmann WSW Components

    2,080
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    03-0518-11H

    03-0518-11H

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    3,382
    RFQ
    03-0518-11H

    Tabla de datos

    518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    07-0518-10T

    07-0518-10T

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    2,669
    RFQ
    07-0518-10T

    Tabla de datos

    518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-1518-10

    08-1518-10

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,199
    RFQ
    08-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    A40-LCG

    A40-LCG

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    4,986
    RFQ

    -

    - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    116-83-306-41-012101

    116-83-306-41-012101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,334
    RFQ
    116-83-306-41-012101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-210-31-012101

    614-87-210-31-012101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,711
    RFQ
    614-87-210-31-012101

    Tabla de datos

    614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-310-31-012101

    614-87-310-31-012101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,553
    RFQ
    614-87-310-31-012101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0102-G-2

    HLS-0102-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,634
    RFQ
    HLS-0102-G-2

    Tabla de datos

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    612-83-308-41-001101

    612-83-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,513
    RFQ
    612-83-308-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AW 127-39/Z-T

    AW 127-39/Z-T

    SOCKET 39 CONTACTS SINGLE ROW

    Assmann WSW Components

    4,661
    RFQ
    AW 127-39/Z-T

    Tabla de datos

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