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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    574602B03300G

    574602B03300G

    HEATSINK TO-220 CLIP-ON/TAB

    Boyd Laconia, LLC

    3,580
    RFQ
    574602B03300G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.690" (17.53mm) 0.860" (21.84mm) - 0.395" (10.03mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.60°C/W Aluminum Black Anodized
    V10196E1

    V10196E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    2,381
    RFQ
    V10196E1

    Tabla de datos

    - Bag Active Top Mount CPU Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.654" (42.00mm) 1.654" (42.00mm) - 0.992" (25.20mm) - - 12.00°C/W Aluminum Black Anodized
    10-L4LB-11G

    10-L4LB-11G

    HEATSINK BGA W/PUSH PINS

    Boyd Laconia, LLC

    2,167
    RFQ
    10-L4LB-11G

    Tabla de datos

    - Bulk Active Top Mount BGA Push Pin Square, Pin Fins 1.630" (41.40mm) 1.780" (45.21mm) - 0.461" (11.70mm) 4.0W @ 60°C 4.90°C/W @ 200 LFM 14.20°C/W Aluminum Black Anodized
    642-60ABT1E

    642-60ABT1E

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    4,692
    RFQ
    642-60ABT1E

    Tabla de datos

    642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.600" (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum Black Anodized
    628-40ABT4E

    628-40ABT4E

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    2,959
    RFQ
    628-40ABT4E

    Tabla de datos

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 4.000" (101.60mm) 2.5W @ 30°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
    EH-210-H125-T411,FG,(GP)

    EH-210-H125-T411,FG,(GP)

    EH-210-H125-T411,FG,(GP)

    Boyd Laconia, LLC

    4,719
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    VRV-55-101E

    VRV-55-101E

    HEATSINK 55MM DEGREASED

    Ohmite

    3,717
    RFQ
    VRV-55-101E

    Tabla de datos

    VR Box Obsolete Board Level, Vertical TO-220, TO-247 Clip and PC Pin Rectangular, Fins 2.165" (55.00mm) 1.335" (33.90mm) - 1.555" (39.50mm) - - - Aluminum Degreased
    6399B- P2G

    6399B- P2G

    6399B- P2G

    Boyd Laconia, LLC

    2,428
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 2.000" (50.80mm) 6.0W @ 30°C 2.00°C/W @ 300 LFM 3.30°C/W Aluminum Black Anodized
    500103B00000G

    500103B00000G

    HEATSINK TO-3 10W H=.50" BLK

    Boyd Laconia, LLC

    4,989
    RFQ
    500103B00000G

    Tabla de datos

    - Bag Not For New Designs Board Level TO-3 Bolt On Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.500" (12.70mm) 6.0W @ 50°C 2.50°C/W @ 400 LFM 7.20°C/W Aluminum Black Anodized
    508700B00000G

    508700B00000G

    HEATSINK 40-PIN DIP GLUE-ON BLK

    Boyd Laconia, LLC

    3,661
    RFQ
    508700B00000G

    Tabla de datos

    - Bag Active Top Mount 40-DIP Thermal Tape, Adhesive (Not Included) Rectangular, Fins 2.000" (50.80mm) 0.530" (13.46mm) - 0.190" (4.83mm) 1.0W @ 30°C 16.00°C/W @ 300 LFM 27.20°C/W Aluminum Black Anodized
    HSB22-606010

    HSB22-606010

    HEAT SINK, BGA, 60 X 60 X 10 MM

    Same Sky (Formerly CUI Devices)

    4,339
    RFQ
    HSB22-606010

    Tabla de datos

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.394" (10.00mm) 9.8W @ 75°C 2.60°C/W @ 200 LFM 7.62°C/W Aluminum Black Anodized
    7148DG

    7148DG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,709
    RFQ
    7148DG

    Tabla de datos

    - Bulk Active Board Level, Vertical Multiwatt, SIP Clip and PC Pin Rectangular, Fins 0.795" (20.19mm) 0.915" (23.24mm) - 0.380" (9.65mm) 1.0W @ 30°C 6.00°C/W @ 600 LFM 16.00°C/W Copper Tin
    110070016

    110070016

    RPI HEAT SINK KIT COPPER/ALUM

    Seeed Technology Co., Ltd

    4,532
    RFQ
    110070016

    Tabla de datos

    - Bulk Obsolete Heat Spreader Kit, Top Mount Raspberry Pi - Square - - - - - - - Aluminum, Copper -
    628-65ABT4E

    628-65ABT4E

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    3,530
    RFQ
    628-65ABT4E

    Tabla de datos

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
    642-60ABT5

    642-60ABT5

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    2,056
    RFQ
    642-60ABT5

    Tabla de datos

    642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.600" (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum Black Anodized
    579003B00000G

    579003B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,692
    RFQ
    579003B00000G

    Tabla de datos

    - Bulk Active Board Level TO-3 Bolt On Rhombus 1.830" (46.48mm) 1.830" (46.48mm) - 1.000" (25.40mm) 4.0W @ 30°C 3.50°C/W @ 200 LFM 6.00°C/W Aluminum Black Anodized
    547-24AB

    547-24AB

    HEATSINK DC/DC QUARTER BRICK

    Wakefield-Vette

    4,291
    RFQ
    547-24AB

    Tabla de datos

    547 Bulk Active Board Level, Vertical Quarter Brick DC/DC Converter Bolt On, Thermal Material Rectangular, Fins 1.450" (36.83mm) 2.280" (57.91mm) - 0.240" (6.10mm) - 3.50°C/W @ 300 LFM - Aluminum Black Anodized
    7020B-TC12-MTG

    7020B-TC12-MTG

    7020B-TC12-MTG

    Boyd Laconia, LLC

    2,379
    RFQ

    -

    - Bulk Active Board Level TO-220 Bolt On and PC Pin Rectangular, Fins 1.255" (31.88mm) 0.470" (11.94mm) - 1.450" (36.83mm) 4.0W @ 40°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
    628-40ABT5

    628-40ABT5

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    3,022
    RFQ
    628-40ABT5

    Tabla de datos

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 4.000" (101.60mm) 2.5W @ 30°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
    MBH33051-23W/2.6

    MBH33051-23W/2.6

    AL HEAT SINK 33X33X23MM

    Malico Inc.

    2,973
    RFQ

    -

    - Active - - - - - - - - - - - - -
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