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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    628-20ABT5

    628-20ABT5

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    2,262
    RFQ
    628-20ABT5

    Tabla de datos

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.200" (5.08mm) 4.0W @ 80°C 8.00°C/W @ 300 LFM - Aluminum Black Anodized
    374124B60023G

    374124B60023G

    374124B60023G

    Boyd Laconia, LLC

    4,210
    RFQ

    -

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.709" (18.00mm) 1.0W @ 30°C 7.40°C/W @ 200 LFM 23.40°C/W Aluminum Black Anodized
    667-25ABPPE

    667-25ABPPE

    HEATSINK TO-220 W/S/O PINS BLK

    Wakefield-Vette

    3,258
    RFQ
    667-25ABPPE

    Tabla de datos

    667 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 2.500" (63.50mm) 6.0W @ 48°C 4.20°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-PCBM1105

    ATS-PCBM1105

    BOARD LEVEL HEAT SINK

    Advanced Thermal Solutions Inc.

    4,665
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 1.30°C/W @ 200 LFM 3.40°C/W Aluminum Black Anodized
    630-25ABT4E

    630-25ABT4E

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    2,548
    RFQ
    630-25ABT4E

    Tabla de datos

    630 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.250" (6.35mm) - 7.00°C/W @ 500 LFM - Aluminum Black Anodized
    HSE-B18508-0396H

    HSE-B18508-0396H

    HEAT SINK, EXTRUSION, TO-218, 50

    Same Sky (Formerly CUI Devices)

    2,745
    RFQ
    HSE-B18508-0396H

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Angled Fins 2.000" (50.80mm) 1.654" (42.00mm) - 0.984" (25.00mm) 12.8W @ 75°C 2.45°C/W @ 200 LFM 5.86°C/W Aluminum Alloy Black Anodized
    2342B

    2342B

    HEAT SINK

    Boyd Laconia, LLC

    4,083
    RFQ
    2342B

    Tabla de datos

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Rectangular, Pin Fins 1.756" (44.60mm) 1.799" (45.70mm) - 0.275" (7.00mm) - 7.26°C/W @ 200 LFM 23.10°C/W Ceramic Black Anodized
    624-45ABT5

    624-45ABT5

    HEATSINK FOR 21MM BGA

    Wakefield-Vette

    4,179
    RFQ
    624-45ABT5

    Tabla de datos

    624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.450" (11.43mm) - 15.00°C/W @ 200 LFM - Aluminum Black Anodized
    642-25ABT4E

    642-25ABT4E

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    3,645
    RFQ
    642-25ABT4E

    Tabla de datos

    642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.250" (6.35mm) - 1.00°C/W @ 400 LFM - Aluminum Black Anodized
    658-45ABT5

    658-45ABT5

    HEATSINK CPU 28MM SQ BLK W/TAPE

    Wakefield-Vette

    3,690
    RFQ
    658-45ABT5

    Tabla de datos

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.450" (11.43mm) 3.0W @ 50°C 6.00°C/W @ 200 LFM - Aluminum Black Anodized
    508222B00000

    508222B00000

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,515
    RFQ
    508222B00000

    Tabla de datos

    - Bulk Active Board Level TO-220 (Dual) Bolt On Rectangular, Fins 1.780" (45.21mm) 1.780" (45.21mm) - 1.000" (25.40mm) 9.0W @ 50°C 1.00°C/W @ 900 LFM 7.40°C/W Aluminum Black Anodized
    PF433G

    PF433G

    MRP/PF433 HEATSINK

    Boyd Laconia, LLC

    2,506
    RFQ

    -

    - Bulk Active Board Level TO-220, TO-262 PC Pin Rectangular, Fins 0.767" (19.50mm) 0.500" (12.70mm) - 0.512" (13.00mm) 2.5W @ 60°C 7.00°C/W @ 500 LFM 20.30°C/W Aluminum Black Anodized
    628-25ABT5

    628-25ABT5

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    2,986
    RFQ
    628-25ABT5

    Tabla de datos

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.250" (6.35mm) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum Black Anodized
    ATS-PCBM1102

    ATS-PCBM1102

    BOARD LEVEL HEAT SINK

    Advanced Thermal Solutions Inc.

    2,412
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 2.50°C/W @ 200 LFM 3.10°C/W Aluminum Black Anodized
    V9772Y1

    V9772Y1

    PROFILE HEATSINK

    Assmann WSW Components

    4,104
    RFQ

    -

    - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 1.969" (50.00mm) 2.559" (65.00mm) - 0.709" (18.00mm) - - 4.90°C/W Aluminum Alloy Black Anodized
    625-45ABT3

    625-45ABT3

    HEATSINK CPU 25MM SQ W/DBL TAPE

    Wakefield-Vette

    2,282
    RFQ
    625-45ABT3

    Tabla de datos

    625 Bulk Active Top Mount BGA Adhesive Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.450" (11.43mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    625-45ABT5

    625-45ABT5

    HEATSINK FOR 25MM BGA

    Wakefield-Vette

    3,098
    RFQ
    625-45ABT5

    Tabla de datos

    625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.450" (11.43mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    7038BG

    7038BG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,643
    RFQ
    7038BG

    Tabla de datos

    - Bulk Active Board Level Multiwatt, SIP Clip Rectangular, Fins 0.620" (15.75mm) 0.915" (23.24mm) - 0.380" (9.65mm) 1.5W @ 40°C 6.00°C/W @ 600 LFM 16.00°C/W Aluminum Black Anodized
    658-60ABT5

    658-60ABT5

    HEATSINK EXTRUSION 27MM

    Wakefield-Vette

    3,920
    RFQ
    658-60ABT5

    Tabla de datos

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.600" (15.24mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
    527-24AB

    527-24AB

    HEATSINK DC/DC HALF BRICK VERT

    Wakefield-Vette

    3,670
    RFQ
    527-24AB

    Tabla de datos

    527 Bulk Active Board Level Half Brick DC/DC Converter Bolt On, Thermal Material Rectangular, Fins 2.280" (57.91mm) 2.400" (60.96mm) - 0.950" (24.13mm) 5.0W @ 60°C 4.20°C/W @ 300 LFM - Aluminum Black Anodized
    Total 122183 Record«Prev1... 22192220222122222223222422252226...6110Next»
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