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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    530101B00100G

    530101B00100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,800
    RFQ
    530101B00100G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-218, TO-247 Bolt On and Board Mounts Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
    6299BG

    6299BG

    6299BG

    Boyd Laconia, LLC

    2,077
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220 Bolt On and PC Pin Rectangular, Fins 1.638" (41.60mm) 0.992" (25.20mm) - 2.000" (50.80mm) - - 6.70°C/W Aluminum Black Anodized
    7129DG

    7129DG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,991
    RFQ
    7129DG

    Tabla de datos

    - Bulk Active Board Level TO-220 Clip Rectangular, Fins 1.040" (26.42mm) 0.866" (22.00mm) - 0.375" (9.52mm) 3.5W @ 70°C 7.00°C/W @ 500 LFM 19.20°C/W Copper Tin
    374424B60023G

    374424B60023G

    374424B60023G

    Boyd Laconia, LLC

    3,723
    RFQ

    -

    - Bulk Active Top Mount BGA, FPGA Solder Anchor Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.709" (18.00mm) 3.0W @ 50°C 6.50°C/W @ 200 LFM 20.30°C/W Aluminum Black Anodized
    580200W00000G

    580200W00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,641
    RFQ
    580200W00000G

    Tabla de datos

    - Bulk Active Top Mount 14-DIP and 16-DIP Press Fit and PC Pin Rectangular, Fins 0.890" (22.61mm) 0.600" (15.24mm) - 0.410" (10.42mm) 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
    FIT0818

    FIT0818

    BLACK ALUMINUM HEATSINKKIT FOR R

    DFRobot

    4,034
    RFQ

    -

    - Bulk Active Top Mount Raspberry Pi 4B Thermal Tape, Adhesive (Included) Rectangular, Pin Fins - - - - - - - Aluminum -
    628-25ABT1E

    628-25ABT1E

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    4,247
    RFQ
    628-25ABT1E

    Tabla de datos

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.250" (6.35mm) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum Black Anodized
    E3A-T220-25E

    E3A-T220-25E

    BLACK ANODIZED HEATSINK

    Ohmite

    4,133
    RFQ
    E3A-T220-25E

    Tabla de datos

    EX Bulk Active Board Level Bridge Rectifiers Bolt On Square, Fins 1.000" (25.40mm) 1.000" (25.40mm) - 1.000" (25.40mm) - - 12.40°C/W Aluminum Black Anodized
    628-65ABT5

    628-65ABT5

    HEATSINK CPU 43MM SQ BLK H=.65"

    Wakefield-Vette

    2,923
    RFQ
    628-65ABT5

    Tabla de datos

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.650" (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum Black Anodized
    SW25-2G

    SW25-2G

    THM,ZA3286 REV 6 SW25-2G

    Boyd Laconia, LLC

    3,216
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) 2.0W @ 30°C 6.00°C/W @ 400 LFM 13.00°C/W Aluminum Black Anodized
    KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

    KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

    KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

    Boyd Laconia, LLC

    2,312
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    VXV-55-101E

    VXV-55-101E

    EXTRUDED HEATSINK 55MM SOT-227

    Ohmite

    2,912
    RFQ
    VXV-55-101E

    Tabla de datos

    VX Box Obsolete Board Level SOT-227 Bolt On Rectangular, Angled Fins 1.917" (48.70mm) 2.165" (55.00mm) - 1.181" (30.00mm) - - - Aluminum Degreased
    1542500-1

    1542500-1

    HTS795-1=HS UPLTD

    TE Connectivity AMP Connectors

    2,626
    RFQ

    -

    - Bag Active - - - - - - - - - - - - -
    DV-T268-101E-TR

    DV-T268-101E-TR

    TO-268 HEAT SINK /POLY TAPE

    Ohmite

    2,394
    RFQ
    DV-T268-101E-TR

    Tabla de datos

    D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.400" (10.16mm) 5.0W @ 35°C 6.00°C/W @ 600 LFM - Aluminum Degreased
    DV-T268-401E-TR

    DV-T268-401E-TR

    TO-268 SMD HEAT SINK

    Ohmite

    2,093
    RFQ
    DV-T268-401E-TR

    Tabla de datos

    D Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.460" (11.68mm) 9.0W @ 43°C 5°C/W @ 500 LFM - Aluminum Degreased
    DV-T263-401E-TR

    DV-T263-401E-TR

    TO-263 SMD HEAT SINK

    Ohmite

    4,283
    RFQ
    DV-T263-401E-TR

    Tabla de datos

    D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.460" (11.68mm) 7.0W @ 45°C 7°C/W @ 500 LFM - Aluminum Degreased
    TV58G

    TV58G

    THM,ZA2102 ISS 4 TV-58G

    Boyd Laconia, LLC

    4,136
    RFQ

    -

    - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 0.887" (22.53mm) 0.749" (19.03mm) - 0.433" (11.00mm) 1.5W @ 50°C 14.00°C/W @ 400 LFM 30.00°C/W Aluminum Black Anodized
    241804B91200G

    241804B91200G

    241804B91200G

    Boyd Laconia, LLC

    2,828
    RFQ

    -

    - Bulk Active Top Mount Eighth Brick DC/DC Converter Bolt On Rectangular, Fins 2.280" (57.90mm) 0.902" (22.90mm) - 0.449" (11.40mm) - 3.00°C/W @ 500 LFM 5.50°C/W - -
    325705R00000G

    325705R00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,733
    RFQ
    325705R00000G

    Tabla de datos

    - Bulk Active Board Level TO-5 Press Fit Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD 0.250" (6.35mm) 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Aluminum Red Anodized
    10-5607-04G

    10-5607-04G

    10-5607-04G

    Boyd Laconia, LLC

    3,181
    RFQ

    -

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 1.470" (37.34mm) 1.470" (37.34mm) - 0.390" (9.91mm) 3.0W @ 70°C 7.00°C/W @ 200 LFM 22.10°C/W Aluminum Black Anodized
    Total 122183 Record«Prev1... 22242225222622272228222922302231...6110Next»
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