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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    HSE-B18381-035H-02

    HSE-B18381-035H-02

    HEAT SINK, EXTRUSION, TO-218, 38

    Same Sky (Formerly CUI Devices)

    2,580
    RFQ
    HSE-B18381-035H-02

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Clip and PC Pin Rectangular, Angled Fins 1.500" (38.10mm) 1.638" (41.60mm) - 0.984" (25.00mm) 12.0W @ 75°C 3.79°C/W @ 200 LFM 6.25°C/W Aluminum Alloy Black Anodized
    566010B00000G

    566010B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,897
    RFQ
    566010B00000G

    Tabla de datos

    - Bulk Active Board Level Multiwatt, SIP Clip Rectangular, Fins 1.220" (30.99mm) 1.000" (25.40mm) - 0.500" (12.70mm) 3.0W @ 40°C 4.00°C/W @ 300 LFM 11.50°C/W Aluminum Black Anodized
    624-25ABT1E

    624-25ABT1E

    HEATSINK FOR 21MM BGA

    Wakefield-Vette

    2,740
    RFQ
    624-25ABT1E

    Tabla de datos

    624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
    HSE-B18317-035H-01

    HSE-B18317-035H-01

    HEAT SINK, EXTRUSION, TO-218, 31

    Same Sky (Formerly CUI Devices)

    3,013
    RFQ
    HSE-B18317-035H-01

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Clip and PC Pin Rectangular, Angled Fins 1.250" (31.75mm) 1.638" (41.60mm) - 0.984" (25.00mm) 10.0W @ 75°C 4.33°C/W @ 200 LFM 7.50°C/W Aluminum Alloy Black Anodized
    V7477Z4

    V7477Z4

    PROFILE HEATSINK

    Assmann WSW Components

    4,846
    RFQ

    -

    - Bulk Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.378" (35.00mm) - 0.500" (12.70mm) - - 7.00°C/W Aluminum Alloy Black Anodized
    KU-SMK-0495-ES-ST-0,6MM-SG

    KU-SMK-0495-ES-ST-0,6MM-SG

    KU-SMK-0495-ES-ST-0,6MM-SG

    Boyd Laconia, LLC

    4,186
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    374024B60023G

    374024B60023G

    374024B60023G

    Boyd Laconia, LLC

    4,395
    RFQ

    -

    - Bulk Active Top Mount BGA Solder Anchor Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.394" (10.00mm) - 11.69°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
    374824B00000G

    374824B00000G

    374824B00000G

    Boyd Laconia, LLC

    4,417
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - -
    HSE-B18317-035H

    HSE-B18317-035H

    HEAT SINK, EXTRUSION, TO-218, 31

    Same Sky (Formerly CUI Devices)

    3,898
    RFQ
    HSE-B18317-035H

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Angled Fins 1.250" (31.75mm) 1.638" (41.60mm) - 0.984" (25.00mm) 9.8W @ 75°C 3.63°C/W @ 200 LFM 7.65°C/W Aluminum Alloy Black Anodized
    V2136N1-F-LP

    V2136N1-F-LP

    HEATSINK CPU W/ADHESIVE STAMPED

    Assmann WSW Components

    4,241
    RFQ
    V2136N1-F-LP

    Tabla de datos

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.394" (10.00mm) - - - Aluminum Alloy Natural Anodized
    630-60AB

    630-60AB

    HEATSINK FOR BGA 35MM

    Wakefield-Vette

    4,508
    RFQ
    630-60AB

    Tabla de datos

    630 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.598" (15.20mm) - 3.00°C/W @ 350 LFM - Aluminum Black Anodized
    530001B02100G

    530001B02100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,816
    RFQ
    530001B02100G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) 20.0W @ 60°C 1.00°C/W @ 800 LFM 8.00°C/W Aluminum Black Anodized
    V8511ZE1

    V8511ZE1

    PROFILE HEATSINK

    Assmann WSW Components

    2,557
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-220 PC Pin Rectangular, Fins 2.500" (63.50mm) 1.638" (41.60mm) - 0.984" (25.00mm) - - 4.10°C/W Aluminum Alloy Black Anodized
    624-25ABT3

    624-25ABT3

    HEATSINK FOR 21MM BGA

    Wakefield-Vette

    2,339
    RFQ
    624-25ABT3

    Tabla de datos

    624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
    V9733E2-LP

    V9733E2-LP

    PROFILE HEATSINK

    Assmann WSW Components

    2,025
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.654" (42.00mm) - 0.984" (25.00mm) 4.0W @ 30°C 2.00°C/W @ 400 LFM 5.50°C/W Aluminum Alloy Black Anodized
    627-10ABPE

    627-10ABPE

    HEATSINK FOR TO218/TO220

    Wakefield-Vette

    4,108
    RFQ
    627-10ABPE

    Tabla de datos

    627 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 1.000" (25.40mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum Black Anodized
    HSE-B18381-060H-W

    HSE-B18381-060H-W

    HEAT SINK, EXTRUSION, TO-218, 38

    Same Sky (Formerly CUI Devices)

    3,463
    RFQ
    HSE-B18381-060H-W

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Angled Fins 1.500" (38.10mm) 1.638" (41.60mm) - 0.984" (25.00mm) 12.0W @ 75°C 3.52°C/W @ 200 LFM 6.25°C/W Aluminum Alloy Black Anodized
    677-10ABP

    677-10ABP

    HEATSINK MULTIWATT 1.0" BLK

    Wakefield-Vette

    2,992
    RFQ
    677-10ABP

    Tabla de datos

    677 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247, Multiwatt Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 52°C 3.10°C/W @ 200 LFM 8.70°C/W Aluminum Black Anodized
    667-10ABSP

    667-10ABSP

    HEATSINK TO-220 W/S/O PINS BLK

    Wakefield-Vette

    2,573
    RFQ
    667-10ABSP

    Tabla de datos

    667 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 1.000" (25.40mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum Black Anodized
    HSE-B18254-060H-W

    HSE-B18254-060H-W

    HEAT SINK, EXTRUSION, TO-218, 25

    Same Sky (Formerly CUI Devices)

    4,890
    RFQ
    HSE-B18254-060H-W

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Angled Fins 1.000" (25.40mm) 1.638" (41.60mm) - 0.984" (25.00mm) 8.1W @ 75°C 3.09°C/W @ 200 LFM 9.26°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 22122213221422152216221722182219...6110Next»
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