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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    642-60AB

    642-60AB

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    2,729
    RFQ
    642-60AB

    Tabla de datos

    642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.600" (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum Black Anodized
    529902B02100G

    529902B02100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,976
    RFQ
    529902B02100G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 30°C 1.50°C/W @ 500 LFM 4.50°C/W Aluminum Black Anodized
    HSE-B20635-035H-W

    HSE-B20635-035H-W

    HEAT SINK, EXTRUSION, TO-220, 63

    Same Sky (Formerly CUI Devices)

    4,695
    RFQ
    HSE-B20635-035H-W

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 2.500" (63.50mm) 1.378" (35.00mm) - 0.500" (12.70mm) 9.2W @ 75°C 4.35°C/W @ 200 LFM 8.15°C/W Aluminum Alloy Black Anodized
    533722B02552G

    533722B02552G

    HEAT SINK

    Boyd Laconia, LLC

    3,545
    RFQ
    533722B02552G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 (Dual) Clip and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.70°C/W Aluminum Black Anodized
    HSE-B630-04H

    HSE-B630-04H

    HEAT SINK, EXTRUSION, TO-220, 63

    Same Sky (Formerly CUI Devices)

    4,642
    RFQ
    HSE-B630-04H

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.480" (63.00mm) 1.378" (35.00mm) - 1.000" (25.40mm) 14.4W @ 75°C 2.31°C/W @ 200 LFM 9.37°C/W Aluminum Alloy Black Anodized
    ATS-PCBM1103

    ATS-PCBM1103

    BOARD LEVEL HEAT SINK

    Advanced Thermal Solutions Inc.

    4,574
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 1.50°C/W @ 200 LFM 4.70°C/W Aluminum Black Anodized
    HSE-B18508-035H-03

    HSE-B18508-035H-03

    HEAT SINK, EXTRUSION, TO-218, 50

    Same Sky (Formerly CUI Devices)

    3,944
    RFQ
    HSE-B18508-035H-03

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Clip and PC Pin Rectangular, Angled Fins 2.000" (50.80mm) 1.638" (41.60mm) - 0.984" (25.00mm) 13.0W @ 75°C 3.44°C/W @ 200 LFM 5.77°C/W Aluminum Alloy Black Anodized
    624-25ABT5

    624-25ABT5

    HEATSINK FOR 21MM BGA

    Wakefield-Vette

    3,999
    RFQ
    624-25ABT5

    Tabla de datos

    624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
    634-20AB

    634-20AB

    HEATSINK TO-220 VERT MT BLK 2.0"

    Wakefield-Vette

    3,161
    RFQ
    634-20AB

    Tabla de datos

    634 Bulk Active Board Level, Vertical TO-220, TO-218 Bolt On Rectangular, Fins 2.000" (50.80mm) 0.640" (16.26mm) - 0.640" (16.26mm) - - - Aluminum Black Anodized
    TGH-0160-01

    TGH-0160-01

    ALUMINIUM HEAT SINK 16X16MM

    t-Global Technology

    14
    RFQ
    TGH-0160-01

    Tabla de datos

    TGH Bulk Obsolete Top Mount - - Square, Fins 0.630" (16.00mm) 0.630" (16.00mm) - 0.433" (11.00mm) - - - Aluminum Clean Anodized
    624-45AB-T4E

    624-45AB-T4E

    HEATSINK CPU 21MM SQ

    Wakefield-Vette

    4,812
    RFQ
    624-45AB-T4E

    Tabla de datos

    624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.450" (11.43mm) - 15.00°C/W @ 200 LFM - Aluminum Black Anodized
    ATS-PCBM1100

    ATS-PCBM1100

    BOARD LEVEL HEAT SINK

    Advanced Thermal Solutions Inc.

    3,571
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 3.10°C/W @ 200 LFM 3.90°C/W Aluminum Black Anodized
    642-35ABT1E

    642-35ABT1E

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    4,423
    RFQ
    642-35ABT1E

    Tabla de datos

    642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    642-35ABT4E

    642-35ABT4E

    HEATSINK FOR 35MM BGA

    Wakefield-Vette

    3,401
    RFQ
    642-35ABT4E

    Tabla de datos

    642 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum Black Anodized
    594302B02853G

    594302B02853G

    HEATSINK TO-220 W/KOOL CLIP BLK

    Boyd Laconia, LLC

    4,735
    RFQ
    594302B02853G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip and Board Locks Rectangular, Fins 2.000" (50.80mm) 1.380" (35.05mm) - 0.480" (12.19mm) 6.0W @ 60°C 3.00°C/W @ 500 LFM - Aluminum Black Anodized
    V2200N1-F-LP

    V2200N1-F-LP

    HEATSINK CPU W/ADHESIVE STAMPED

    Assmann WSW Components

    2,469
    RFQ
    V2200N1-F-LP

    Tabla de datos

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.512" (13.00mm) - - - Aluminum Alloy Natural Anodized
    6038DG

    6038DG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,142
    RFQ
    6038DG

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 40°C 8.00°C/W @ 500 LFM 18.00°C/W Aluminum Tin
    V2201N1-LP

    V2201N1-LP

    HEATSINK CPU STAMPED

    Assmann WSW Components

    4,304
    RFQ
    V2201N1-LP

    Tabla de datos

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Fins 1.457" (37.00mm) 1.457" (37.00mm) - 0.551" (14.00mm) - - - Aluminum Alloy Natural Anodized
    HSE-B18635-035H

    HSE-B18635-035H

    HEAT SINK, EXTRUSION,TO-218, 63.

    Same Sky (Formerly CUI Devices)

    4,094
    RFQ
    HSE-B18635-035H

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Angled Fins 2.500" (63.50mm) 1.638" (41.60mm) - 0.984" (25.00mm) 16.7W @ 75°C 2.24°C/W @ 200 LFM 4.49°C/W Aluminum Alloy Black Anodized
    HSE-B18635-035H-04

    HSE-B18635-035H-04

    HEAT SINK, EXTRUSION, TO-218, 63

    Same Sky (Formerly CUI Devices)

    2,558
    RFQ
    HSE-B18635-035H-04

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-218 Clip and PC Pin Rectangular, Angled Fins 2.500" (63.50mm) 1.638" (41.60mm) - 0.984" (25.00mm) 15.1W @ 75°C 2.38°C/W @ 200 LFM 4.97°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 22132214221522162217221822192220...6110Next»
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